A Material of Semiconductor Package with Low Dielectric Constant, Low Dielectric Loss and Flat Surface for High Frequency and Low Power Propagation(Session2: Silicon Devices I)

概要

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For the next generation LSI package, low power consumption and high frequency propagation must be satisfied. In order to meet such requirements, we investigated a dielectric material for semiconductor package which has three superior features: low dielectric constant, low dielectric loss, and a flat surface. The propagation loss of a microstrip line on the developed material is about 40% of the conventional material at 30GHz. The significant reduction of the propagation loss is caused by the flat surface and low dielectric loss. This technology greatly contributes to the next generation of semiconductor packages.
社団法人電子情報通信学会の論文
2008-07-02