Sugimura Masahiko | Research and Development Center, Zeon Corporation
スポンサーリンク
概要
関連著者
-
TERAMOTO Akinobu
New Industry Creation Hatchery Center, Tohoku University
-
大見 忠弘
東北大学
-
IMAI Hiroshi
Graduate School of Science and Engineering, Kagoshima University
-
SUGAWA Shigetoshi
Graduate School of Engineering, Tohoku University
-
OHMI Tadahiro
New Industry Creation Hatchery Center, Tohoku University
-
Teramoto A
New Industry Creation Hatchery Center Tohoku University
-
Sugawa S
Graduate School Of Engineering Tohoku University
-
Ohmi Tadahiro
Department Of Electronic Engineering Tohoku University
-
Ohmi Tadahiro
The New Industry Creation Hatchery Center (niche) Tohoku University
-
Ohmi T
Tohoku Univ. Sendai‐shi Jpn
-
SUGAWA Sigetoshi
Tohoku University
-
Sugimura Masahiko
Research and Development Center, Zeon Corporation
-
Kawasaki Masafumi
Research and Development Center, Zeon Corporation
-
Teramoto Akinobu
New Industry Creation Hatchery Center Tohoku University
-
Teramoto Akinobu
Department Of Electronic Engineering Faculty Of Engineering Tohoku University
-
Sugawa Shigetoshi
Graduate School Of Engineering Tohoku University
-
Sugawa Shigetoshi
Department Of Electronic Engineering Tohoku University
-
Sugimura Masahiko
Research And Development Center Zeon Corporation
-
Ohmi Tadahiro
New Industry Creation Hatchery Center Future Information Industry Creation Center Tohoku University
-
Teramoto Akinobu
New Industry Creation Hatchery Center Tohoku Univ.
-
Teramoto Akinobu
University Of Tohoku New Industry Creation Hatchery Center (niche)
-
Kawasaki Masafumi
Research And Development Center Zeon Corporation
-
Imai Hiroshi
Graduate School Of Engineering Tohoku University
-
Ohmi Tadahiro
New Industry Creation Hatchery Center (niche) Tohoku University
-
Teramoto Akinobu
New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai 980-8579, Japan
-
Sugimura Masahiko
Research & Development Center, Zeon Corp., 1-2-1 Yako, Kawasaki-ku, Kawasaki 210-9507, Japan
著作論文
- A Material of Semiconductor Package with Low Dielectric Constant, Low Dielectric Loss and Flat Surface for High Frequency and Low Power Propagation(Session2: Silicon Devices I)
- A Material of Semiconductor Package with Low Dielectric Constant, Low Dielectric Loss and Flat Surface for High Frequency and Low Power Propagation(Session2: Silicon Devices I)