Advanced SOI Devices Using CMP and Wafer Bonding

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概要

• 論文の詳細を見る
• 1996-08-26

著者

• Imai M

  Univ. Osaka Prefecture Sakai

• Horie H

  Fujitsu Lab. Ltd. Atsugi Jpn

• SUZUKI Kunihiro

  Fujitsu Laboratories Ltd.

• Nara Yasuo

  Fujitsu Laboratories Ltd.

• Suzuki Kunihiro

  Department Of Histology Cytology And Developmental Anatomy Nihon University School Of Dentistry At M

• Suzuki K

  Oki Electric Ind. Co. Ltd. Hachioji‐shi Jpn

• ITOH Akio

  Fujitsu Laboratories Ltd.

• ARIMOTO Yoshihiro

  Fujitsu Laboratories Ltd.

• Tanaka Tsuyoshi

  Semiconductor Device Research Center Semiconductor Company Matsushita Electric Industrial Co. Ltd.

• Terahara Takafumi

  The Authors Are With Optoelectronic Systems Laboratory Network System Laboratories Fujitsu Laborator

• Tanaka T

  Semiconductor Device Research Center Semiconductor Company Matsushita Electric Industrial Co. Ltd.

• Itoh A

  Ricoh Co. Ltd. Miyagi Jpn

• HORIE Hiroshi

  Fujitsu Laboratories Ltd.

• NAKAMURA Shunji

  Fujitsu Laboratories Ltd.

• TANAKA Tetsu

  Fujitsu Laboratories Ltd.

• IMAI Masahiko

  Fujitsu Laboratories Ltd.

• Itoh A

  Fujitsu Laboratories Ltd.

• ARIMOTO Yoshihiro

  System LSI Development Labs., FUJITSU LABORATORIES LTD.

• Arimoto Y

  System Lsi Development Labs. Fujitsu Laboratories Ltd.

• Suzuki Kunihiro

  Fujitsu Laboratories Limited., 10-1 Morinosato-Wakamiya, Atsugi 243-0197, Japan

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