Mn2O3 Slurry Reuse by Circulation Achieving High Constant Removal Rate
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概要
- 論文の詳細を見る
Fumed silica is widely used in SiO2 chemical mechanical polishing (CMP). In semiconductor processes, only fresh slurry is used, and used slurry is disposed. Sustainable development demands a reduction in waste. Since reuse of slurry is effective for reducing the amount of used slurry generated, we investigated the reuse of Mn2O3 slurry and conventional fumed silica slurry. In both cases, abrasive concentration decreases as reuse time increases. The removal rate for Mn2O3 slurry maintains a value 4 times that of the conventional fumed silica slurry during slurry reuse, because the removal rate for Mn2O3 slurry is almost constant for solid concentrations between 1.0 and 10 wt %. Pad conditioning was not performed for Mn2O3 slurry. The removal rate for conventional slurry decreases as the number of times of reuse increases, even when pad conditioning is appropriately performed.
- 2012-04-25
著者
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ARIMOTO Yoshihiro
Fujitsu Laboratories Ltd.
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Nakamura Ko
Fujitsu Laboratories Ltd.
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KISHII Sadahiro
Fujitsu Laboratories Ltd.
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岸井 貞浩
(株)富士通研究所
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Watanabe Satoru
Fujita Health University
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Kishii Sadahiro
Device Integration Technology Laboratories, Fujitsu Laboratories Ltd., Atsugi, Kanagawa 243-0197, Japan
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Arimoto Yoshihiro
Fujitsu Laboratories Ltd., Atsugi, Kanagawa 243-0197, Japan
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Hanawa Kenzo
Showa Denko K.K., Minato, Tokyo 105-8518, Japan
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Kurokawa Syuhei
Kyushu University, Fukuoka 836-0395, Japan
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Doi Toshiro
Kyushu University, Fukuoka 836-0395, Japan
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岸井 貞浩
(株) 富士通研究所
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Nakamura Ko
Fujitsu Laboratories Ltd., Atsugi, Kanagawa 243-0197, Japan
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Kurokawa Syuhei
Kyushu University, Fukuoka 819-0395, Japan
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Doi Toshiro
Kyushu University, Fukuoka 819-0395, Japan
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