Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate
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概要
- 論文の詳細を見る
The rapid growth of high-frequency wireless communication demands high-performance packaging structures at low cost. A flip-chip interconnect is one of the most promising technologies owing to its low parasitic effect and high performance at high frequencies. In this study, the in-house fabricated In<sub>0.6</sub>Ga<sub>0.4</sub>As metamorphic high electron mobility transistor (mHEMT) device was flip-chip-assembled using a commercially available low-cost organic substrate. The packaged device with the optimal flip-chip structure exhibited almost similar DC and RF results to the bare die. An exopy-based underfill was applied to the improvement of reliability with almost no degradation of the electrical characteristics. Measurement results revealed that the proposed packaging structure maintained a low minimum noise figure of 3 dB with 6 dB associated gain at 62 GHz. Such a superior performance after flip-chip packaging demonstrates the feasibility of the proposed low-cost organic substrate for commercial high-frequency applications up to the W-band.
- 2011-09-25
著者
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Miyamoto Yasuyuki
Department Of Electrical And Electronic Engineering
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Kuo Chien-i
Department Of Materials Science And Engineering National Chiao-tung University
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Wang Chin-te
Department Of Materials Science And Engineering National Chiao-tung University
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Chang Edward
Department Of Communications Engineering Yuan Ze University
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Chang Edward
Department of Materials Science and Engineering, National Chiao-Tung University, Hsinchu 300, Taiwan
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Wang Chin-Te
Department of Materials Science and Engineering, National Chiao-Tung University, Hsinchu 300, Taiwan
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Lim Wee-Chin
Department of Materials Science and Engineering, National Chiao-Tung University, Hsinchu 300, Taiwan
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Hsu Li-Han
Department of Materials Science and Engineering, National Chiao-Tung University, Hsinchu 300, Taiwan
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Hsu Heng-Tung
Department of Communications Engineering and Communication Research Center, Yuan Ze University, Chunli 320, Taiwan
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Lim Wee-Chin
Department of Material Science and Engineering, National Chiao-Tung University, Hsinchu 300, Taiwan
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Wang Chin-Te
Department of Material Science and Engineering, National Chiao-Tung University, Hsinchu 300, Taiwan
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