Fabrication of InP/InGaAs SHBT on Si Substrate by Using Transferred Substrate Process
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概要
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With the aim of achieving heterogeneous integration of compound semiconductors with silicon technology, the fabrication of an InP/InGaAs transferred-substrate HBT (TS-HBT) on a Si substrate is reported. A current gain of 70 and a maximum current density of 12.3mA/µm2 were confirmed in a TS-HBT with a 340-nm-wide emitter. From microwave characteristics of the TS-HBT obtained after de-embedding, a cutoff frequency (fT) of 510GHz and a 26% reduction of the base-collector capacitance were estimated. However, the observed fT was too high for an HBT with a 150-nm-thick collector. This discrepancy can be explained by the error in de-embedding, because an open pad is observed to have large capacitance and strong frequency dependence due to the conductivity of the Si substrate.
著者
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Miyamoto Yasuyuki
Department Of Electrical And Electronic Engineering
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YAMAGUCHI Yutaro
Department of Physical Electronics, Tokyo Institute of Technology
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SAGAI Takeshi
Department of Physical Electronics, Tokyo Institute of Technology
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