Wang Chin-te | Department Of Materials Science And Engineering National Chiao-tung University
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概要
関連著者
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Wang Chin-te
Department Of Materials Science And Engineering National Chiao-tung University
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Chang Edward
Department Of Communications Engineering Yuan Ze University
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Hsu Heng-Tung
Department of Communications Engineering and Communication Research Center, Yuan Ze University, Chunli 320, Taiwan
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Wang Chin-Te
Department of Material Science and Engineering, National Chiao-Tung University, Hsinchu 300, Taiwan
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Kuo Chien-i
Department Of Materials Science And Engineering National Chiao-tung University
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Chiang Che-yang
Department Of Communications Engineering Yuan Ze University
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Lim Wee-Chin
Department of Material Science and Engineering, National Chiao-Tung University, Hsinchu 300, Taiwan
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Chang Edward
Department Of Materials Science And Engineering And Microelectronics And Information Systems Researc
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Miyamoto Yasuyuki
Department Of Electrical And Electronic Engineering
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CHIANG Che-Yang
Department of Communications Engineering, Yuan Ze University
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HSU Heng-Tung
Department of Communications Engineering, Yuan Ze University
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HSU Heng-Shou
Department of Electronic Engineering, Feng Chia University
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Hsu Heng-tung
Department Of Communications Engineering Yuan Ze University
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Chang Edward
Department of Materials Science and Engineering, National Chiao-Tung University, Hsinchu 300, Taiwan
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Wang Chin-Te
Department of Materials Science and Engineering, National Chiao-Tung University, Hsinchu 300, Taiwan
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Lim Wee-Chin
Department of Materials Science and Engineering, National Chiao-Tung University, Hsinchu 300, Taiwan
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Hsu Li-Han
Department of Materials Science and Engineering, National Chiao-Tung University, Hsinchu 300, Taiwan
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Hsu Heng-Tung
Department of Communications Engineering, Yuan Ze University, Chunli 320, Taiwan
著作論文
- Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate
- V-Band Flip-Chip Assembled Gain Block Using In_Ga_As Metamorphic High-Electron-Mobility Transistor Technology
- Assessment of Thermal Impact on Performance of Metamorphic High-Electron-Mobility Transistors on Polymer Substrates Using Flip-Chip-on-Board Technology