Thermal Stability of Pt Bottom Electrodes for Ferroelectric Capacitors

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概要

• 論文の詳細を見る

• The stress of Pt films deposited at various temperatures and its correlation with the formation of hillocks during heat treatment were investigated. The residual stress changes from compressive to tensile as the deposition temperature increases. The compressive residual stress of a Pt film deposited at room temperature is initially relaxed by the shrinkage of the film thickness and then by hillock formation at a certain maximum compressive stress when the Pt film is heat-treated. On the other hand, Pt films deposited at higher temperatures (up to 500℃) have a high tensile residual stress. The Pt film maintains its smooth surface and no hillocks appear during the heat treatment at 500℃ when the residual stress is tensile, since the threshold temperature at which hillocks form increases.

• 社団法人応用物理学会の論文
• 1998-04-15

著者

• Hiratani M

  Central Research Laboratory Hitachi Ltd.

• Hiratani M

  Central Research Laboratory Hitachi Ltd

• Hiratani Masahiko

  Central Research Laboratory Hitachi Ltd.

• MIURA Hideo

  Mechanical Engineering Research Laboratory, Hitachi, Ltd.

• Matsui Yasushi

  Electronics Research Laboratory Corporate Research & Development Matsushita Electronics Corporat

• MATSUI Yuichi

  Central Research Laboratory, Hitachi, Ltd.

• Muto Y

  The Institute For Materials Research Tohoku University

• Miura H

  Hitachi Ltd. Tsuchiura‐shi Jpn

• Fujisaki Y

  R&d Association For Future Electron Devices

• Fujisaki Yoshihisa

  Central Research Laboratory Hitachi Limited

• KUMAGAI Yukihiro

  Mechanical Engineering Research Laboratory, Hitachi, Lid.

• Kumagai Yukihiro

  Mechanical Engineering Research Laboratory Hitachi Lid.

• Miura Hideo

  Mechanical Engineering Research Laboratory Hitachi Lid.

• Fujisaki Yoshihisa

  R&D Association for Future Electron Devices

• Kumagai Yuki

  Mechanical Engineering Research Laboratory, Hitachi, Lid.

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