Characterization of In20Ge15Sb10Te55 Phase Change Material for Phase Change Memory with Low Power Operation and Good Data Retention
スポンサーリンク
概要
- 論文の詳細を見る
An indium-incorporated germanium--antimony--telluride material, In20Ge15Sb10Te55 (IGST), was investigated as a recording material for phase change memory. The crystallization temperature of IGST was 226 °C, which is 75 °C higher than that of conventional GST. The reset current of the device using IGST was about 10 mA for a plug 180 nm in diameter, which enabled a low-power operation, compared with the GST-based device. A cycle endurance of up to 1.5\times 10^{4} was achieved. The data retention was estimated to be 10 years at 145 °C. These data clearly show that IGST exhibits promising characteristics as a recording material for phase change memory.
- 2012-03-25
著者
-
MATSUI Yuichi
Central Research Laboratory, Hitachi, Ltd.
-
Takaura Norikatsu
Central Research Laboratory Hitachi. Ltd.
-
Fujisaki Yoshihisa
Central Research Laboratory Hitachi Limited
-
Kurotsuchi Kenzo
Central Research Laboratory, Hitachi, Ltd., Kokubunji, Tokyo 185-8601, Japan
-
Fujisaki Yoshihisa
Central Research Laboratory, Hitachi, Ltd., Kokubunji, Tokyo 185-8601, Japan
-
Morikawa Takahiro
Central Research Laboratory, Hitachi, Ltd., Kokubunji, Tokyo 185-8601, Japan
-
Morikawa Takahiro
Central Research Laboratory, Hitachi Ltd., 1-280 Higashi-Koigakubo, Kokubunji, Tokyo 185-8601, Japan
-
Takaura Norikatsu
Central Research Laboratory, Hitachi, Ltd., Kokubunji, Tokyo 185-8601, Japan
関連論文
- Nondestruetive Characterization of Deep Levels in Semi-Insulating GaAs Wafers Using Microwave Impedance Measurement
- Dependence of Deep Level Concentration on Nonstoiehiometry in MOCVD GaAs
- Electro-Luminescence from Ultra-Thin Silicon
- Inversion Electron Mobility Affected by Phase Separation in High-Permittivity Gate Dielectrics
- Properties of Ruthenium Films Prepared by Liquid Source Metalorganic Chemical Vapor Deposition Using Ru(EtCp)_2 with Tetrahydrofuran Solvent
- Conformal Platinum Electrodes Prepared by Chemical Vapor Deposition Using a Liquid MeCpPtMe_3 Precursor in an Oxidizing Atmosphere
- Thermal Stability of a RuO_2 Electrode Prepared by DC Reactive Sputtering
- Hydrogen Reduction Properties of RuO_2 Electrodes
- A 500℃ fabrication process for MIM capacitors-based on a Ta_2O_5/Nb_2O_5 bilayer with high permittivity-for DRAM and SoC applications
- Highly Oxidation-Resistant TiN Barrier Layers for Ferroelectric Capacitors
- Hydrogen-related Degradation and Recovery Phenomena in Pb(Zr,Ti)O_3 Capacitors with a Platinum Electrode
- Highly Oxidation-Resistant TiN Barrier Layers for Ferroelectric Capacitors
- Analysis of Decomposed Layer Appearing on the Surface of Barium Strontium Titanate
- Effects of Post-Annealing Temperatures and Ambient Atmospheres on the Electrical Properties of Ultrathin (Ba, Sr) TiO_3 Capacitors
- Analysis of Boron Penetration and Gate Depletion Using Dual-Gate PMOSFETs for High Performance G-Bit DRAM Design(Special Issue on Microelectronic Test Structures)
- IrO_2/Pb(Zr_xTi_)O_3(PZT)/Pt Ferroelectric Thin-Film Capacitors Resistant to Hydrogen-Annealing Damage
- IrO_2/Pb (Zr_xTi_)O_3(PZT)/Pt Ferroelectric Thin-Film Capacitors Resistant to an Interlayer-Dielectric-Deposition Process
- Oxygen Diffusion in Pt Botton Electrodes of Ferroelectric Capacitors
- Resistive Switching Ion-Plug Memory for 32-nm Technology Node and Beyond
- Current Status of Nonvolatile Semiconductor Memory Technology
- Organic Ferroelectric Diodes with Long Retention Characteristics Suitable for Non-Volatile Memory Applications
- Thermal Stability of Pt Bottom Electrodes for Ferroelectric Capacitors
- Electro-Luminescence from Ultra-Thin Silicon
- Low-Voltage Operation of Ferroelectric Gate Thin Film Transistors Using Indium Gallium Zinc Oxide-Channel and Ferroelectric Polymer Poly(vinylidene fluoride--trifluoroethylene)
- Eliminating the Threshold-Voltage Offset of p-Channel Metal-Oxide-Semiconductor Field Effect Transistors in High-Density Dynamic Random Access Memory
- Electrical Phase-Change Memory: Fundamentals and State of the Art
- Characterization of In20Ge15Sb10Te55 Phase Change Material for Phase Change Memory with Low Power Operation and Good Data Retention
- Fatigueless Ferroelectric Capacitors with Ruthenium Bottom and Top Electrodes Formed by Metalorganic Chemical Vapor Deposition
- Inversion Electron Mobility Affected by Phase Separation in High-Permittivity Gate Dielectrics