Nondestructive characterization of temperature-dependent backbone Si-O-Si structure in porous silica films by in-situ Fourier-transform infrared spectroscopy
スポンサーリンク
概要
- 論文の詳細を見る
- 2006-09-13
著者
-
KIKKAWA Takamaro
MIRAI, Advanced Semiconductor Research Center, AIST
-
吉川 公麿
広島大学:産業総合研究所
-
HATA Nobuhiro
ASRC, AIST
-
NAKAYAMA Takahiro
MIRAI-ASET
-
FUJII Nobutoshi
MIRAI-ASET
-
Hata Nobuhiro
Asrc Aist
-
Hata Nobuhiro
Advanced Semiconductor Research Center (asrc) National Institute Of Advanced Industrial Science And
-
Hata Nobuhiro
Advanced Semiconductor Research Center (asrc) National Institute Of Advanced Science And Technology
-
Kikkawa Takamaro
Advanced Semiconductor Research Center (asrc) National Institute Of Advanced Industrial Science And
-
Kikkawa Takamaro
Mirai Advanced Semiconductor Research Center (asrc) National Institute Of Advanced Industrial Scienc
-
Takada Syozo
Advanced Semiconductor Research Center National Institute Of Advanced Industrial Science And Technol
-
TAKADA Syozo
ASRC, AIST
-
LI Xianying
ASRC, AIST
-
Takada Syozo
Asrc Aist
-
Takada Syozo
Advanced Semiconductor Research Center (asrc) National Institute Of Advanced Science And Technology
-
Kikkawa Takamaro
Millenium Research For Advanced Information Technology (mirai)-asrc Aist
-
Hata Nobuhiro
Advanced Semiconductor Research Center National Institute Of Advanced Industrial Science And Technol
-
Li Xianying
Asrc Aist
-
Nakayama Takahiro
MIRAI, Association of Super-Advanced Electronics Technologies (ASET), Tsukuba, Ibaraki 305-8569, Japan
関連論文
- 高空孔率(50%)高強度(9GPa)自己組織化ポーラスシリカ膜を用いた32nmノードLSI向け超低誘電率膜(k=2.1)Cuダマシン多層配線(配線・実装技術と関連材料技術)
- Effect of High-Resistivity Si Substrate on Antenna Transmission Gain for On-Chip Wireless Interconnects
- A New Plasma-Enhanced Co-Polymerization (PCP) Technology for Reinforcing Mechanical Properties of Organic Silica Low-k/Cu Interconnects on 300 mm Wafers(低誘電率層間膜,配線材料及び一般)
- 自己集合体化技術を用いた超低誘電率多孔質シリカ膜(低誘電率層間膜,配線材料及び一般)
- 低誘電率層間絶縁膜中のリン添加効果によるCuイオンドリフト抑制効果
- Simple Models on Enhancement of Mechanical Properties of Porous Silica Low-k Films by Tetramethylcyclotetrasiloxane(TMCTS) Vapor Annealing Treatment
- Ultra low-k 膜対応のCMP技術
- A 2.4GHz Differential Wavelet Generator in 0.18μm CMOS for 1.4Gbps UWB Impulse Radio in Wireless Inter/Intra-Chip Data Communication
- CT-1-7 無線インタコネクトと3次元集積(CT-1.Si集積回路配線の解析と設計,エレクトロニクス2)
- Low-k/Cu技術の現状と将来動向(High Speed and Optoelectronic Technology II, 先端デバイスの基礎と応用に関するアジアワークショップ(AWAD2005))
- ポーラスシリカの低誘電率絶縁膜への応用
- ハイパーブレイン実現を目指した無線インタコネクションを用いた三次元集積技術(VLSI一般(ISSCC2005特集))
- Transmission Characteristics of Gaussian Monocycle Pulses for Inter-Chip Wireless Interconnections Using Integrated Antennas
- A CMOS Monocycle Pulse Generation Circuit in a Ultra-Wideband Transmitter for Intra/Inter Chip Wireless Interconnection
- VLSIチップ内・チップ間無線インタコネクト(回路技術(一般,超高速・低電力・高機能を目指した新アーキテクチャ))
- A CMOS Monocycle Pulse Generation Circuit of UWB Transmitter for Intra/Inter Chip Wireless Interconnection
- 配線技術
- BST電気特性の下部電極依存性(ゲート絶縁膜,容量膜,機能膜及びメモリ技術)
- ワイヤレス配線におけるSiおよび低誘電率基板の影響
- ウェハ保管環境の MOS デバイス特性への影響
- (Ba,Sr)TiO_3膜物性の下地Si基板方位依存性
- (Ba,Sr)TiO_3膜キャパシタ特性の電極金属依存性
- Alダマシンプロセスによる多層配線形成
- ギガビットスケールDRAM用TiN/Ti-CVDコンタクト技術
- 高温スパッタを用いたサブクォーターマイクロンのチタンサリサイド形成技術
- シリコン熱酸化膜のホットエレクトロン耐性に及ぼす有機ガス汚染の影響
- Plasma-enhanced polymerization thin films as a drift barrier for Cu interconnects
- Mechanical Strength of Multilayered Dielectric Structures Measured by Laser-Pulse Generated Surface-Acoustic-Wave Technique
- Molecular Orbital Calculation of the Elastic Modulus and the Dielectric Constant for Ultra Low-k Organic Polymers
- Theoretical Investigation of Dielectric Constant and Elastic Modulus of Two-Dimensional Periodic Porous Silica Films with Elliptical Cylindrical Pores
- Mechanical Property and Network Structure of Porous Silica Films
- Control of Pore Structures in Periodic Porous Silica Low-k Films
- Mechanical Property Determination of Thin Porous Low-k Films by Twin-Transducer Laser Generated Surface Acoustic Waves
- Theoretical Analysis of Elastic Modulus and Dielectric Constant for Low-k Two-Dimensional Periodic Porous Silica Films
- 0.15μm CMOS用CoSi_2サリサイド技術
- Effect of Phosphorus Atom in Self-Assembled Monolayer as a Drift Barrier for Advanced Copper Interconnects
- Influences of Skeletal Structure and Porosity on Dielectric and Mechanical Properties of Porous Organosilica Low-k Films
- XPSによるサブミクロンCuビアホールのクリーニング方法の解析
- Measurement of Copper Drift in Methylsilsesquiazane-Methylsilsesquioxane Dielectric Films
- Measurement of Copper Drift in Methylsilsesquioxane Dielectric Films
- Direct Observation of Electromigration and Induced Stress in Cu Nanowire
- (Ba,Sr)TiO_3高誘電率膜特性の電極金属依存症
- Transient Capacitance Spectroscopy of Copper-Ion-Drifted Methylsilsesquiazane-Methylsilsesquioxane Interlayer Dielectrics
- Role of Frictional Force on the Polishing Rate of Cu Chemical Mechanical Polishing
- Determination of mechanical properties of porous silica low-k films on Si substrates using orientation dependence of surface acoustic wave
- Theoretical Investigation into Effects of Pore Size and Pore Position Distributions on Dielectric Constant and Elastic Modulus of Two-Dimensional Periodic Porous Silica Films
- Nondestructive characterization of dielectric stack structures by laser-pulse-generated surface acoustic wave analysis
- The structural origin of determining the coefficient of thermal expansion for porous silica low-k films
- Nondestructive characterization of temperature-dependent backbone Si-O-Si structure in porous silica films by in-situ Fourier-transform infrared spectroscopy
- Infrared Complex Dielectric Function Analysis for Chemical Bonding Structure of Porous Silica Low Dielectric Constant Films
- Adsorption in-situ Spectroscopic Ellipsometry Analysis of Disordered Porous Silica Low-k Films
- Comparison of Pore Shape Models for Small Angle X-ray Scattering of a Disordered Porous Silica Low-k Film
- Electrical Characteristics of Porous Zeolite Interlayer Dielectrics
- Microstructure Characterization of Skeletal Silica in Porous Low-k Films by Infrared Spectroscopic Ellipsometry
- Low-k/Cu技術の現状と将来動向(High Speed and Optoelectronic Technology II, 先端デバイスの基礎と応用に関するアジアワークショップ(AWAD2005))
- 低誘電率層間絶縁膜中へのCuイオンドリフトによる絶縁破壊
- Electrical Characteristics of Mesoporous Pure-Silica–Zeolite Film
- Integration of Self-Assembled Porous Silica in Low-$k$/Cu Damascene Interconnects
- A Novel Photosensitive Porous Low-$k$ Interlayer Dielectric Film
- ULSI多層配線技術の課題
- 多層配線技術とスケーリング
- ULSIの微細化と多層配線技術への課題
- Plasma-Enhanced Co-Polymerization of Organo-siloxane and Hydrocarbon for Low-$k$/Cu Interconnects
- Molecular Orbital Calculation of the Elastic Modulus and the Dielectric Constant for Ultra Low-$k$ Organic Polymers
- Plasma-Enhanced-Polymerization Thin-Film as a Drift Barrier for Cu Ions
- Plasma Etch Rates of Porous Silica Low-$k$ Films with Different Dielectric Constants
- Recovery from Plasma-Process-Induced Damage in Porous Silica Low-$k$ Films by Organosiloxane Vapor Annealing
- Young’s Modulus Enhancement of Mesoporous Pure-Silica–Zeolite Low-Dielectric-Constant Films by Ultraviolet and Silylation Treatments
- Mechanical Property and Network Structure of Porous Silica Films
- Theoretical Investigation of Dielectric Constant and Elastic Modulus of Three-Dimensional Isotropic Porous Silica Films with Cubic and Disordered Pore Arrangements
- Effects of Surfactants on the Properties of Ordered Periodic Porous Silica Films
- Determination of Mechanical Properties of Porous Silica Low-$k$ Films on Si Substrates Using Orientation Dependence of Surface Acoustic Wave
- Transient Capacitance Spectroscopy of Copper-Ion-Drifted Methylsilsesquiazane-Methylsilsesquioxane Interlayer Dielectrics
- Role of Frictional Force on the Polishing Rate of Cu Chemical Mechanical Polishing
- Direct Observation of Electromigration and Induced Stress in Cu Nanowire
- Theoretical Investigation into Effects of Pore Size and Pore Position Distributions on Dielectric Constant and Elastic Modulus of Two-Dimensional Periodic Porous Silica Films
- Control of Pore Structures in Periodic Porous Silica Low-$k$ Films