Simple Models on Enhancement of Mechanical Properties of Porous Silica Low-k Films by Tetramethylcyclotetrasiloxane(TMCTS) Vapor Annealing Treatment
スポンサーリンク
概要
- 論文の詳細を見る
- 2004-09-15
著者
-
Ichikawa Rie
Advanced Semiconductor Research Center Aist
-
SEINO Yutaka
MIRAI, Advanced Semiconductor Research Center, AIST
-
TAKASU Yuko
Advanced Semiconductor Research Center, AIST
-
KOHMURA Kazuo
MIRAI, Association of Super-Advanced Electronics Technologies
-
TANAKA Hirofumi
MIRAI, Association of Super-Advanced Electronics Technologies
-
OIKE Shunsuke
MIRAI, Association of Super-Advanced Electronics Technologies
-
MURAKAMI Masami
MIRAI, Association of Super-Advanced Electronics Technologies
-
KIKKAWA Takamaro
MIRAI, Advanced Semiconductor Research Center, AIST
-
Takasu Yuko
Advanced Semiconductor Research Center Aist
-
Kohmura Kazuo
Mirai Association Of Super-advanced Electronics Technologies
-
Oike Shunsuke
Mirai Association Of Super-advanced Electronics Technologies
-
Kikkawa Takamaro
Mirai Advanced Semiconductor Research Center Aist
-
Kikkawa Takamaro
Mirai Advanced Semiconductor Research Center (asrc) National Institute Of Advanced Industrial Scienc
-
Seino Yutaka
Mirai Advanced Semiconductor Research Center Aist
-
Murakami Masami
Mirai Association Of Super-advanced Electronics Technologies
-
Tanaka Hirofumi
Mirai Association Of Super-advanced Electronics Technologies
関連論文
- Simple Models on Enhancement of Mechanical Properties of Porous Silica Low-k Films by Tetramethylcyclotetrasiloxane(TMCTS) Vapor Annealing Treatment
- Plasma-enhanced polymerization thin films as a drift barrier for Cu interconnects
- Mechanical Strength of Multilayered Dielectric Structures Measured by Laser-Pulse Generated Surface-Acoustic-Wave Technique
- Molecular Orbital Calculation of the Elastic Modulus and the Dielectric Constant for Ultra Low-k Organic Polymers
- Theoretical Investigation of Dielectric Constant and Elastic Modulus of Two-Dimensional Periodic Porous Silica Films with Elliptical Cylindrical Pores
- Mechanical Property and Network Structure of Porous Silica Films
- Control of Pore Structures in Periodic Porous Silica Low-k Films
- Mechanical Property Determination of Thin Porous Low-k Films by Twin-Transducer Laser Generated Surface Acoustic Waves
- Theoretical Analysis of Elastic Modulus and Dielectric Constant for Low-k Two-Dimensional Periodic Porous Silica Films
- Direct Observation of Electromigration and Induced Stress in Cu Nanowire
- Transient Capacitance Spectroscopy of Copper-Ion-Drifted Methylsilsesquiazane-Methylsilsesquioxane Interlayer Dielectrics
- Role of Frictional Force on the Polishing Rate of Cu Chemical Mechanical Polishing
- Theoretical Investigation into Effects of Pore Size and Pore Position Distributions on Dielectric Constant and Elastic Modulus of Two-Dimensional Periodic Porous Silica Films
- The structural origin of determining the coefficient of thermal expansion for porous silica low-k films
- Nondestructive characterization of temperature-dependent backbone Si-O-Si structure in porous silica films by in-situ Fourier-transform infrared spectroscopy
- Infrared Complex Dielectric Function Analysis for Chemical Bonding Structure of Porous Silica Low Dielectric Constant Films
- Adsorption in-situ Spectroscopic Ellipsometry Analysis of Disordered Porous Silica Low-k Films
- Electrical Characteristics of Porous Zeolite Interlayer Dielectrics
- Microstructure Characterization of Skeletal Silica in Porous Low-k Films by Infrared Spectroscopic Ellipsometry
- Integration of Self-Assembled Porous Silica in Low-$k$/Cu Damascene Interconnects
- Plasma-Enhanced Co-Polymerization of Organo-siloxane and Hydrocarbon for Low-$k$/Cu Interconnects
- Molecular Orbital Calculation of the Elastic Modulus and the Dielectric Constant for Ultra Low-$k$ Organic Polymers
- Plasma-Enhanced-Polymerization Thin-Film as a Drift Barrier for Cu Ions
- Plasma Etch Rates of Porous Silica Low-$k$ Films with Different Dielectric Constants
- Recovery from Plasma-Process-Induced Damage in Porous Silica Low-$k$ Films by Organosiloxane Vapor Annealing
- Mechanical Property and Network Structure of Porous Silica Films
- Theoretical Investigation of Dielectric Constant and Elastic Modulus of Three-Dimensional Isotropic Porous Silica Films with Cubic and Disordered Pore Arrangements
- Effects of Surfactants on the Properties of Ordered Periodic Porous Silica Films
- Transient Capacitance Spectroscopy of Copper-Ion-Drifted Methylsilsesquiazane-Methylsilsesquioxane Interlayer Dielectrics
- Role of Frictional Force on the Polishing Rate of Cu Chemical Mechanical Polishing
- Direct Observation of Electromigration and Induced Stress in Cu Nanowire
- Theoretical Investigation into Effects of Pore Size and Pore Position Distributions on Dielectric Constant and Elastic Modulus of Two-Dimensional Periodic Porous Silica Films
- Control of Pore Structures in Periodic Porous Silica Low-$k$ Films