Transient Capacitance Spectroscopy of Copper-Ion-Drifted Methylsilsesquiazane-Methylsilsesquioxane Interlayer Dielectrics
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概要
- 論文の詳細を見る
- 2004-12-15
著者
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KIKKAWA Takamaro
MIRAI, Advanced Semiconductor Research Center, AIST
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YOSHINO Takenobu
MIRAI-Advanced Semiconductor Research Center (ASRC), National Institute of Advanced Industrial Scien
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HATA Nobuhiro
MIRAI-Advanced Semiconductor Research Center (ASRC), National Institute of Advanced Industrial Scien
関連論文
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- Plasma-enhanced polymerization thin films as a drift barrier for Cu interconnects
- Mechanical Strength of Multilayered Dielectric Structures Measured by Laser-Pulse Generated Surface-Acoustic-Wave Technique
- Molecular Orbital Calculation of the Elastic Modulus and the Dielectric Constant for Ultra Low-k Organic Polymers
- Theoretical Investigation of Dielectric Constant and Elastic Modulus of Two-Dimensional Periodic Porous Silica Films with Elliptical Cylindrical Pores
- Mechanical Property and Network Structure of Porous Silica Films
- Nondestructive Characterization of a Series of Periodic Porous Silica Films by in situ Spectroscopic Ellipsometry in a Vapor Cell
- Control of Pore Structures in Periodic Porous Silica Low-k Films
- Mechanical Property Determination of Thin Porous Low-k Films by Twin-Transducer Laser Generated Surface Acoustic Waves
- Theoretical Analysis of Elastic Modulus and Dielectric Constant for Low-k Two-Dimensional Periodic Porous Silica Films
- Direct Observation of Electromigration and Induced Stress in Cu Nanowire
- Transient Capacitance Spectroscopy of Copper-Ion-Drifted Methylsilsesquiazane-Methylsilsesquioxane Interlayer Dielectrics
- Role of Frictional Force on the Polishing Rate of Cu Chemical Mechanical Polishing
- Theoretical Investigation into Effects of Pore Size and Pore Position Distributions on Dielectric Constant and Elastic Modulus of Two-Dimensional Periodic Porous Silica Films
- The structural origin of determining the coefficient of thermal expansion for porous silica low-k films
- Nondestructive characterization of temperature-dependent backbone Si-O-Si structure in porous silica films by in-situ Fourier-transform infrared spectroscopy
- Infrared Complex Dielectric Function Analysis for Chemical Bonding Structure of Porous Silica Low Dielectric Constant Films
- Adsorption in-situ Spectroscopic Ellipsometry Analysis of Disordered Porous Silica Low-k Films
- Electrical Characteristics of Porous Zeolite Interlayer Dielectrics
- Microstructure Characterization of Skeletal Silica in Porous Low-k Films by Infrared Spectroscopic Ellipsometry
- Integration of Self-Assembled Porous Silica in Low-$k$/Cu Damascene Interconnects
- Plasma-Enhanced Co-Polymerization of Organo-siloxane and Hydrocarbon for Low-$k$/Cu Interconnects
- Plasma-Enhanced-Polymerization Thin-Film as a Drift Barrier for Cu Ions
- Transient Capacitance Spectroscopy of Copper-Ion-Drifted Methylsilsesquiazane-Methylsilsesquioxane Interlayer Dielectrics