Kikkawa Takamaro | Mirai Advanced Semiconductor Research Center (asrc) National Institute Of Advanced Industrial Scienc

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概要

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著作論文

Simple Models on Enhancement of Mechanical Properties of Porous Silica Low-k Films by Tetramethylcyclotetrasiloxane(TMCTS) Vapor Annealing Treatment
Plasma-enhanced polymerization thin films as a drift barrier for Cu interconnects
Mechanical Strength of Multilayered Dielectric Structures Measured by Laser-Pulse Generated Surface-Acoustic-Wave Technique
Theoretical Investigation of Dielectric Constant and Elastic Modulus of Two-Dimensional Periodic Porous Silica Films with Elliptical Cylindrical Pores
Mechanical Property Determination of Thin Porous Low-k Films by Twin-Transducer Laser Generated Surface Acoustic Waves
Theoretical Analysis of Elastic Modulus and Dielectric Constant for Low-k Two-Dimensional Periodic Porous Silica Films
The structural origin of determining the coefficient of thermal expansion for porous silica low-k films
Nondestructive characterization of temperature-dependent backbone Si-O-Si structure in porous silica films by in-situ Fourier-transform infrared spectroscopy
Infrared Complex Dielectric Function Analysis for Chemical Bonding Structure of Porous Silica Low Dielectric Constant Films
Adsorption in-situ Spectroscopic Ellipsometry Analysis of Disordered Porous Silica Low-k Films
Electrical Characteristics of Porous Zeolite Interlayer Dielectrics
Microstructure Characterization of Skeletal Silica in Porous Low-k Films by Infrared Spectroscopic Ellipsometry
Plasma-Enhanced Co-Polymerization of Organo-siloxane and Hydrocarbon for Low-$k$/Cu Interconnects
Molecular Orbital Calculation of the Elastic Modulus and the Dielectric Constant for Ultra Low-$k$ Organic Polymers
Plasma-Enhanced-Polymerization Thin-Film as a Drift Barrier for Cu Ions
Plasma Etch Rates of Porous Silica Low-$k$ Films with Different Dielectric Constants
Recovery from Plasma-Process-Induced Damage in Porous Silica Low-$k$ Films by Organosiloxane Vapor Annealing
Mechanical Property and Network Structure of Porous Silica Films
Theoretical Investigation of Dielectric Constant and Elastic Modulus of Three-Dimensional Isotropic Porous Silica Films with Cubic and Disordered Pore Arrangements
Effects of Surfactants on the Properties of Ordered Periodic Porous Silica Films
Transient Capacitance Spectroscopy of Copper-Ion-Drifted Methylsilsesquiazane-Methylsilsesquioxane Interlayer Dielectrics
Role of Frictional Force on the Polishing Rate of Cu Chemical Mechanical Polishing
Direct Observation of Electromigration and Induced Stress in Cu Nanowire
Theoretical Investigation into Effects of Pore Size and Pore Position Distributions on Dielectric Constant and Elastic Modulus of Two-Dimensional Periodic Porous Silica Films
Control of Pore Structures in Periodic Porous Silica Low-$k$ Films

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