Kikkawa Takamaro | Advanced Semiconductor Research Center (asrc) National Institute Of Advanced Industrial Science And

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概要

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著作論文

高空孔率(50%)高強度(9GPa)自己組織化ポーラスシリカ膜を用いた32nmノードLSI向け超低誘電率膜(k=2.1)Cuダマシン多層配線(配線・実装技術と関連材料技術)
A New Plasma-Enhanced Co-Polymerization (PCP) Technology for Reinforcing Mechanical Properties of Organic Silica Low-k/Cu Interconnects on 300 mm Wafers(低誘電率層間膜,配線材料及び一般)
自己集合体化技術を用いた超低誘電率多孔質シリカ膜(低誘電率層間膜,配線材料及び一般)
Ultra low-k 膜対応のCMP技術
CT-1-7 無線インタコネクトと3次元集積(CT-1.Si集積回路配線の解析と設計,エレクトロニクス2)
Low-k/Cu技術の現状と将来動向(High Speed and Optoelectronic Technology II, 先端デバイスの基礎と応用に関するアジアワークショップ(AWAD2005))
ポーラスシリカの低誘電率絶縁膜への応用
ハイパーブレイン実現を目指した無線インタコネクションを用いた三次元集積技術(VLSI一般(ISSCC2005特集))
Transmission Characteristics of Gaussian Monocycle Pulses for Inter-Chip Wireless Interconnections Using Integrated Antennas
VLSIチップ内・チップ間無線インタコネクト(回路技術(一般,超高速・低電力・高機能を目指した新アーキテクチャ))
Plasma-enhanced polymerization thin films as a drift barrier for Cu interconnects
Mechanical Strength of Multilayered Dielectric Structures Measured by Laser-Pulse Generated Surface-Acoustic-Wave Technique
Effect of Phosphorus Atom in Self-Assembled Monolayer as a Drift Barrier for Advanced Copper Interconnects
Nondestructive characterization of dielectric stack structures by laser-pulse-generated surface acoustic wave analysis
The structural origin of determining the coefficient of thermal expansion for porous silica low-k films
Nondestructive characterization of temperature-dependent backbone Si-O-Si structure in porous silica films by in-situ Fourier-transform infrared spectroscopy
Infrared Complex Dielectric Function Analysis for Chemical Bonding Structure of Porous Silica Low Dielectric Constant Films
Adsorption in-situ Spectroscopic Ellipsometry Analysis of Disordered Porous Silica Low-k Films
Comparison of Pore Shape Models for Small Angle X-ray Scattering of a Disordered Porous Silica Low-k Film
Electrical Characteristics of Porous Zeolite Interlayer Dielectrics
Microstructure Characterization of Skeletal Silica in Porous Low-k Films by Infrared Spectroscopic Ellipsometry
Low-k/Cu技術の現状と将来動向(High Speed and Optoelectronic Technology II, 先端デバイスの基礎と応用に関するアジアワークショップ(AWAD2005))

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