Influences of Skeletal Structure and Porosity on Dielectric and Mechanical Properties of Porous Organosilica Low-k Films
スポンサーリンク
概要
- 論文の詳細を見る
- 2007-09-19
著者
-
Hata Nobuhiro
Asrc Aist
-
Hata Nobuhiro
Advanced Semiconductor Research Center (asrc) National Institute Of Advanced Industrial Science And
-
Hata Nobuhiro
Advanced Semiconductor Research Center (asrc) National Institute Of Advanced Science And Technology
-
Hata Nobuhiro
Advanced Semiconductor Research Center National Institute Of Advanced Industrial Science And Technol
-
TAKADA Syozo
Advanced Semiconductor Research Center (ASRC), National Institute of Advanced Industrial Science and
-
Yoshino Takenobu
Advanced Semiconductor Research Center (asrc) National Institute Of Advanced Industrial Science And
-
Yoshino Takenobu
Advanced Semiconductor Research Center National Institute Of Advanced Industrial Science And Technol
-
SEINO Yutaka
Advanced Semiconductor Research Center, National Institute of Advanced Industrial Science and Techno
-
Seino Yutaka
Advanced Semiconductor Research Center National Institute Of Advanced Industrial Science And Technol
-
Takada Syozo
Advanced Semiconductor Research Center National Institute Of Advanced Industrial Science And Technol
-
Takada Syozo
Asrc Aist
-
Takada Syozo
Advanced Semiconductor Research Center (asrc) National Institute Of Advanced Science And Technology
-
Hata Nobuhiro
Advanced Semiconductor Research Center National Institute Of Advanced Industrial Science And Technol
-
Seino Yutaka
Advanced Semiconductor Research Center (ASRC), National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba, Ibaraki 305-8569, Japan
関連論文
- Plasma-enhanced polymerization thin films as a drift barrier for Cu interconnects
- Mechanical Strength of Multilayered Dielectric Structures Measured by Laser-Pulse Generated Surface-Acoustic-Wave Technique
- Theoretical Investigation of Dielectric Constant and Elastic Modulus of Two-Dimensional Periodic Porous Silica Films with Elliptical Cylindrical Pores
- Mechanical Property and Network Structure of Porous Silica Films
- Mechanical Property Determination of Thin Porous Low-k Films by Twin-Transducer Laser Generated Surface Acoustic Waves
- Theoretical Analysis of Elastic Modulus and Dielectric Constant for Low-k Two-Dimensional Periodic Porous Silica Films
- Effect of Phosphorus Atom in Self-Assembled Monolayer as a Drift Barrier for Advanced Copper Interconnects
- Influences of Skeletal Structure and Porosity on Dielectric and Mechanical Properties of Porous Organosilica Low-k Films
- Determination of mechanical properties of porous silica low-k films on Si substrates using orientation dependence of surface acoustic wave
- Nondestructive characterization of dielectric stack structures by laser-pulse-generated surface acoustic wave analysis
- The structural origin of determining the coefficient of thermal expansion for porous silica low-k films
- Nondestructive characterization of temperature-dependent backbone Si-O-Si structure in porous silica films by in-situ Fourier-transform infrared spectroscopy
- Infrared Complex Dielectric Function Analysis for Chemical Bonding Structure of Porous Silica Low Dielectric Constant Films
- Adsorption in-situ Spectroscopic Ellipsometry Analysis of Disordered Porous Silica Low-k Films
- Comparison of Pore Shape Models for Small Angle X-ray Scattering of a Disordered Porous Silica Low-k Film
- Electrical Characteristics of Porous Zeolite Interlayer Dielectrics
- Microstructure Characterization of Skeletal Silica in Porous Low-k Films by Infrared Spectroscopic Ellipsometry
- Electrical Characteristics of Mesoporous Pure-Silica–Zeolite Film
- Young’s Modulus Enhancement of Mesoporous Pure-Silica–Zeolite Low-Dielectric-Constant Films by Ultraviolet and Silylation Treatments
- Mechanical Property and Network Structure of Porous Silica Films
- Determination of Mechanical Properties of Porous Silica Low-$k$ Films on Si Substrates Using Orientation Dependence of Surface Acoustic Wave