Multiple-Height Microstructure Fabricated by Deep Reactive Ion Etching and Selective Ashing of Resist Layer Combined with Ultraviolet Curing
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概要
- 論文の詳細を見る
UV-cured photoresist is applied to the delay masking process to realize a multiple-height microstructure for the first time. Although the UV-cured photoresist is a soft mask, its material property becomes stable against resist thinner and UV exposure. A layered resist pattern can be realized by stacking normal photoresist on the UV-cured photoresist. The UV curing increases the glass transition temperature from 120 to 160 °C. By controlling the temperature, the normal photoresist can be ashed twice as fast as the UV-cured photoresist. This selectivity can be combined with the deep reactive ion etching of Si, and a microstructure having three different etching depths is realized, thus forming a micromirror. The multiple-height structure is advantageous for reducing the inertia of the mirror plate. For the same rotational spring constant, the micromirror has a higher resonant frequency, which is required for realizing higher-resolution laser displays.
- 2012-01-25
著者
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Hori Masaru
Department Of Electrical Engineering And Computer Science Graduate School Of Engineering Nagoya Univ
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Sasaki Minoru
Department Of Acoustic Design Kyushu Institute Of Design
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Iwamoto Takuya
Department of Advanced Science and Technology, Toyota Technological Institute, Nagoya 468-8511, Japan
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Kumagai Shinya
Department of Advanced Science and Technology, Toyota Technological Institute, Nagoya 468-8511, Japan
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Kumagai Shinya
Department of Advanced Science and Technology, Toyota Technological Institute, 2-12-1, Hisakata, Tenpaku-ku, Nagoya 468-8511, Japan
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Hikita Akiyoshi
Department of Advanced Science and Technology, Toyota Technological Institute, Nagoya 468-8511, Japan
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Tomikawa Takashi
Department of Advanced Science and Technology, Toyota Technological Institute, Nagoya 468-8511, Japan
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