Interconnect and Substrate Structure for Gigascale Integration

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概要

• 論文の詳細を見る

• Signal wave propagation properties for a high-speed gigascale integration (GSI) system LSI featuring an operation frequency of more than 10 GHz have been analyzed and discussed by solving the cylindrical Maxwell's equations directly using a stacked coaxial structure. The results give us a good perspective and enable us to predict the ultrahigh-speed and miniaturized interconnect characteristics. The metal substrate structure is essential to suppress the substrate surface potential fluctuations and the substrate-induced signal attenuation and delay. The gas-isolated interconnect structure can effectively reduce the signal attenuation and delay. The combination of the gas-isolated interconnect and the metal substrate structure is the most promising solution for an interconnect and a substrate in GSI.

• Publication Office, Japanese Journal of Applied Physics, Faculty of Science, University of Tokyoの論文
• 2001-04-30

著者

• Kotani Koji

  Department Of Electronic Engineering Graduate School Of Engineering Tohoku University

• Sugawa Shigetoshi

  Department Of Electronic Engineering Tohoku University

• Ohmi Tadahiro

  New Industry Creation Hatchery Center (niche) Tohoku University

• Morimoto Akihiro

  Department Of Biotechnology Graduate School Of Engineering Osaka University

• Morimoto Akihiro

  Department of Electronic Engineering, Tohoku University, 05 Aza-Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan

• Kotani Koji

  Department of Electronic Engineering, Tohoku University, 05 Aza-Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan

• Ohmi Tadahiro

  New Industry Creation Hatchery Center, Tohoku University, 05 Aza-Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan

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