Interconnect and Substrate Structure for Gigascale Integration
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概要
- 論文の詳細を見る
Signal wave propagation properties for a high-speed gigascale integration (GSI) system LSI featuring an operation frequency of more than 10 GHz have been analyzed and discussed by solving the cylindrical Maxwell's equations directly using a stacked coaxial structure. The results give us a good perspective and enable us to predict the ultrahigh-speed and miniaturized interconnect characteristics. The metal substrate structure is essential to suppress the substrate surface potential fluctuations and the substrate-induced signal attenuation and delay. The gas-isolated interconnect structure can effectively reduce the signal attenuation and delay. The combination of the gas-isolated interconnect and the metal substrate structure is the most promising solution for an interconnect and a substrate in GSI.
- Publication Office, Japanese Journal of Applied Physics, Faculty of Science, University of Tokyoの論文
- 2001-04-30
著者
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Kotani Koji
Department Of Electronic Engineering Graduate School Of Engineering Tohoku University
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Sugawa Shigetoshi
Department Of Electronic Engineering Tohoku University
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Ohmi Tadahiro
New Industry Creation Hatchery Center (niche) Tohoku University
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Morimoto Akihiro
Department Of Biotechnology Graduate School Of Engineering Osaka University
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Morimoto Akihiro
Department of Electronic Engineering, Tohoku University, 05 Aza-Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan
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Kotani Koji
Department of Electronic Engineering, Tohoku University, 05 Aza-Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan
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Ohmi Tadahiro
New Industry Creation Hatchery Center, Tohoku University, 05 Aza-Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan
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