Electrical characteristics of novel non-porous low-k dielectric fluorocarbon on Cu interconnects for 22nm generation and beyond (Special issue: Advanced metallization for ULSI applications)

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概要

• 論文の詳細を見る

著者

• NOZAWA Toshihisa

  TOKYO ELECTRON LTD.

• MATSUOKA Takaaki

  TOKYO ELECTRON LTD.

• Sugawa Shigetoshi

  Graduate School Of Engineering Tohoku University

• KUROKI Shin-Ichiro

  Graduate School of Engineering, Tohoku University

• Ohmi Tadahiro

  New Industry Creation Hatchery Center (niche) Tohoku University

• Teramoto Akinobu

  New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai 980-8579, Japan

• Nemoto Takenao

  New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai 980-8579, Japan

• Tomita Yugo

  New Industry Creation Hatchery Center, Tohoku University, Sendai 980-8579, Japan

• Saito Akane

  Tokyo Electron Technology Development Institute, Inc., Nirasaki, Yamanashi 407-0175, Japan

• Miyatani Kotaro

  Tokyo Electron Technology Development Institute, Inc., Nirasaki, Yamanashi 407-0175, Japan

• Gu Xun

  Graduate School of Engineering, Tohoku University

• Kobayashi Yasuo

  Tokyo Electron Technology Development Institute, Inc., Nirasaki, Yamanashi 407-0175, Japan

• Shirotori Akihide

  New Industry Creation Hatchery Center, Tohoku University, Sendai 980-8579, Japan

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