Ultra-Thin Silicon Oxynitride Films as Cu Diffusion Barrier for Lowering Interconnect Resistivity

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概要

• 論文の詳細を見る
• 2000-08-28

著者

• OHMI Tadahiro

  New Industry Creation Hatchery Center, Tohoku University

• NAKAO Shin-ichi

  Department of Chemical System Engineering, Faculty of Engineering, The University of Tokyo

• Nakao Shin-ichi

  Department Of Electronic Engineering Graduate School Of Engineering Tohoku University

• Nakao Shin-ichi

  Department Of Chemical Engineering Faculty Of Engineering University Of Tokyo

• Saito Yuji

  Department Of Electronic Engineering Graduate School Of Engineering Tohoku University

• HIRAYAMA Masaki

  Department of Electronic Engineering, Graduate School of Engineering, Tohoku University

• SEKINE Katsuyuki

  Department of Electronic Engineering, Graduate school of Engineering, Tohoku University

• NANBU Tetsuhiro

  Department of Electronic Engineering, Graduate School of Engineering, Tohoku University

• Saito Y

  Department Of Electrical And Electronic Engineering Faculty Of Engineering Mie University

• HIGUCHI Masaaki

  TOSHIBA CORPORATION

• HIRAYAMA Masaki

  New Industry Creation Hatchery Center, Tohoku University

• Hirayama Masaki

  Toshiba Corporation

• Hirayama Masaki

  Department Of Electronic Engineering Faculty Of Engineering Tohoku University

• Ohmi Tadahiro

  New Industry Creation Hatchery Center Future Information Industry Creation Center Tohoku University

• Nanbu Tetsuhiro

  Department Of Electronic Engineering Graduate School Of Engineering Tohoku University

• Saito Yuji

  Department Of Anesthesiology Gunma Prefectural Cardiovascular Center

• Nakao Shin-ichi

  Department Of Anesthesia Kyoto University Hospital

• Sekine K

  Japan Aviation Electronics Ind. Ltd. Tokyo Jpn

• Sekine Katsuyuki

  Department Of Electronic Engineering Faculty Of Engineering Tohoku University

• Ohmi Tadahiro

  New Industry Creation Hatchery Center (niche) Tohoku University

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