Thin and Low-Resistivity Tantalum Nitride Diffusion Barrier and Giant-Grain Copper Interconnects for Advanced ULSI Metallization

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概要

• 論文の詳細を見る
• 1998-09-07

著者

• Numata Masashi

  Department Of Electronic Engineering Graduate School Of Engineering Tohoku University:laboratory For

• Numata Masashi

  Department Of Electronic Engineering Graduate School Of Engineering Tohoku University

• OHMI Tadahiro

  New Industry Creation Hatchery Center, Tohoku University

• NAKAO Shin-ichi

  Department of Chemical System Engineering, Faculty of Engineering, The University of Tokyo

• Nakao Shin-ichi

  Department Of Electronic Engineering Graduate School Of Engineering Tohoku University:laboratory For

• Nakao Shin-ichi

  Department Of Chemical Engineering Faculty Of Engineering University Of Tokyo

• Ohmi T

  Tohoku Univ. Sendai Jpn

• Ohmi Tadahiro

  New Industry Creation Hatchery Center Future Information Industry Creation Center Tohoku University

• Nakao S

  Department Of Electronic Engineering Graduate School Of Engineering Tohoku University:laboratory For

• Nakao Shin-ichi

  Department Of Anesthesia Kyoto University Hospital

• Ohmi Tadahiro

  New Industry Creation Hatchery Center (niche) Tohoku University

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