Preparation of Cu_<10>Zr_7 Intermetallic Compound Film and Its Application as a Diffusion Barrier in Cu/Cu_<10>Zr_7/ZrN/Si Contact System
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概要
- 論文の詳細を見る
- 社団法人応用物理学会の論文
- 1997-12-15
著者
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SASAKI Katsutaka
Department of Materials Science, Kitami Institute of Technology
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YANAGISAWA Hideto
Department of Electrical and Electronic Engineering, Faculty of Engineering, Kitami Institute of Tec
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YOSHIMOTO Ken-ichi
Department of Electrical Engineering, Asahikawa National College of Technology
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Sasaki Katsutaka
Department Of Electrical And Electronic Engineering Faculty Of Engineering Kitami Institute Of Techn
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Sasaki Katsutaka
Department Of Materials Science Kitami Institute Of Technology
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Yanagisawa Hideto
Department Of Electrical And Electronic Engineering Kitami Institute Of Technology
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Yoshimoto Ken-ichi
Department Of Electrical Engineering Asahikawa National College Of Technology
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Yoshimoto Ken-ichi
Department of Electrical and Computer Engineering, Asahikawa National College of Technology, 2-2 Shunkodai, Asahikawa, Hokkaido 071-8142, Japan
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