Low-Loss Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology(Microwaves, Millimeter-Waves)
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概要
- 論文の詳細を見る
This paper proposes high-Q distributed constant passive devices using wafer-level chip scale package (WL-CSP) technology, which can be realized on a Si CMOS chip. A 90° directional coupler using the WL-CSP technology has center frequency of 25.6GHz, insertion loss of -0.5dB and isolation of -29.8dB in the measurement result. The WL-CSP technology contributes to realize low-loss RF passive devices on Si CMOS chip, which is indispensable to achieve small-size, cost-effective and low-power monolithic wireless communication circuits (MWCCs).
- 社団法人電子情報通信学会の論文
- 2007-03-01
著者
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Masu K
Research Institute Of Electrical Communication Tohoku University
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Masu Kazuya
Integrated Research Institute
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Ito H
National Agricultural Res. Organization Mie Jpn
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Sato Masakazu
Electron Device Laboratory Fujikura Ltd.
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Okada Kenichi
Integrated Research Institute Tokyo Institute Of Technology
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Okada K
Communications Research Laboratory Ministry Of Posts And Telecommunications
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Okada K
The Design Technology Development Laboratory Ic Group Sharp Corporation
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Masu Kazuya
東工大
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Ito Hiroyuki
Precision And Intelligence Laboratory Tokyo Institute Of Technology
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Itoh H
Osaka Univ. Pharmaceutical Sci. Osaka Jpn
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Okada K
Keio Univ. Yokohama‐shi Jpn
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ITOI Kazuhisa
Electron Device Laboratory, Fujikura Ltd.
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ITO Tatsuya
Electron Device Laboratory, Fujikura Ltd.
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Itoi Kazuhisa
Electron Device Laboratory Fujikura Ltd.
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Ito H
Precision And Intelligence Laboratory Tokyo Institute Of Technology
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Sugawara Hirotaka
Integrated Research Institute Tokyo Institute Of Technology
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ITO Hiroyuki
Integrated Research Institute, Tokyo Institute of Technology
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SUGITA Hideyuki
Integrated Research Institute, Tokyo Institute of Technology
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YAMAUCHI Ryozo
Fujikura Ltd.
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Ito Tatsuya
Electron Device Laboratory Fujikura Ltd.
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Sugita Hideyuki
Integrated Research Institute Tokyo Institute Of Technology
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