Self-Aligned 10-nm Barrier Layer Formation Technology for Fully Self-Aligned Metallization Metal-Oxide-Semiconductor Field-Effect-Transistor
スポンサーリンク
概要
- 論文の詳細を見る
- Publication Office, Japanese Journal of Applied Physics, Faculty of Science, University of Tokyoの論文
- 1998-06-01
著者
-
Lee C‐h
Lg Electronics Inst. Technol. Seoul Kor
-
Masu K
Research Institute Of Electrical Communication Tohoku University
-
Masu Kazuya
Integrated Research Institute
-
Masu Kazuya
Research Institute Of Electrical Communication Tohoku University
-
Lee C‐h
Keimyung Univ. Daegu Kor
-
TSUBOUCHI Kazuo
Research Institute of Electrical Communication, Tohoku University
-
Masu Kazuya
東工大
-
YOKOYAMA Michio
Research Institute of Electrical Communication, Tohoku University
-
LEE Chang-Hun
Research Institute of Electrical Communication, Tohoku University
-
Matsuhashi Hideki
Research Institute of Electrical Communication, Tohoku University
-
GOTOH Akio
Research Institute of Electrical Communication, Tohoku University
-
Lee Chang-hun
Research Institute Of Electrical Communication Tohoku University
-
Tsubouchi K
Tohoku Univ. Sendai Jpn
-
Yokoyama M
Kawasaki Heavy Ind. Ltd. Chiba Jpn
-
Matsuhashi H
Oki Electric Ind. Co. Ltd. Tokyo Jpn
-
Tsubouchi Kazuo
Research Institute Of Electrical Communicaiton Tohoku University
-
Gotoh Akio
Research Institute Of Electrical Communication Tohoku University
-
Lee Chang-Hum
Research Institute of Electrical Communication, Tohoku University
-
TSUBOUCHI Kazuo
Research Institute of Electric Communication (RIEC), Tohoku University
関連論文
- Wide-band, high linear low noise amplifier design in 0.18um CMOS technology
- Switched-Current Analog Programmable Filter for Software-Defined Radio
- All Digital Wireless Modem LSI for Software Defined Radio
- Lower Boundary of Supply Voltage in Digital ULSI Based on the Communication Theory
- Low Power Current-Cut Switched-Current Matched Filter for CDMA (Special Issue on Low-Power High-Performance VLSI Processors and Technologies)
- Novel Low-Power Switched-Current Matched Filter for Direct-Sequence Code-Division-Multiple-Access Wireless Communication
- Full-Duplex Asynchronous Spread Spectrum Modem Using a SAW Convolver for 2.4-GHz Wireless LAN (Special Issue on Personal, Indoor and Mobile Radio Communications)
- Novel Narrowband Interference Rejection for an Asynchronous Spread Spectrum Wireless Modem Using a SAW Convolver (Special Issue on Spread Spectrum Techniques and Applications)
- Novel FFT LSI for Orthogonal Frequency Division Multiplexing Using Current Mode Circuit
- Novel FFT LSI for OFDM Using Current Mode Circuit
- Surface Acoustic Wave Properties of Atomically Flat-Surface Aluminium Nitride Epitaxial Film on Sapphire
- SS-CDMA Flexible Wireless Network: Implementation of Approximately Synchronized CDMA Modem for Uplink
- Design and Implementation of Spread Spectrum Wireless Switch with Low Power Consumption(Special Section on Fundamentals of Information and Communications)
- Growth of Atomically Flat-Surface Aluminum Nitride Epitaxial Film by Metalorganic Chemical Vapor Deposition
- A Universal Equivalent Circuit Model for Ceramic Capacitors
- Layout-Aware Compact Model of MOSFET Characteristics Variations Induced by STI Stress
- C-12-43 CMOS Power Amplifier in 65nm Technology
- C-12-37 CMOS Inverter-based Wideband LNA in 65nm Technology
- Preparation of BaTiO_3 Thin Films by Metalorganic Chemical Vapor Deposition Using Ultrasonic Spraying ( FERROELECTRIC MATERIALS AND THEIR APPLICATIONS)
- An Evaluation Method of the Number of Monte Carlo STA Trials for Statistical Path Delay Analysis
- Analytical Estimation of Path-Delay Variation for Multi-Threshold CMOS Circuits
- 2-Port Modeling Technique for Surface-Mount Passive Components Using Partial Inductance Concept
- A Time-Slicing Ring Oscillator for Capturing Time-Dependent Delay Degradation and Power Supply Voltage Fluctuation
- One-Shot Voltage-Measurement Circuit Utilizing Process Variation
- Application of Correlation-Based Regression Analysis for Improvement of Power Distribution Network
- Reconfigurable RF CMOS Circuit for Cognitive Radio
- A High-Efficiency CMOS Class-B Push-Pull Power Amplifier for Code-Division-Multiple-Access Cellular System
- Aluminum Chemical Vapor Deposition Technology for High Deposition Rate and Surface Morphology Improvement
- Crystallographic Structures and Parasitic Resistances of Self-Aligned Silicide TiSi_2/Self-Aligned Nitrided Barrier Layer/Selective Chemical Vapor Deposited Aluminum in Fully Self-Aligned Metallization Metal Oxide Semiconductor Field-Effect Transistor
- Self-Aligned 10-nm Barrier Layer Formation Technology for Fully Self-Aligned Metallization Metal-Oxide-Semiconductor Field-Effect-Transistor
- Self-Aligned 10-nm Barrier Layer Formation Technology for Fully Self-Aligned Metallization MOSFET
- Tunable CMOS LNA Using a Variable Inductor for a Reconfigurable RF Circuit
- A 0.49-6.50GHz Wideband LC-VCO with High-IRR in a 180nm CMOS Technology
- Effect of Gate Materials on Generation of Interface State by Hot-Carrier Injection
- Interacting Self-Timed Pipelines and Elementary Coupling Control Modules
- A 5GHz Band Low Noise and Wide Tuning Range Si-CMOS VCO with a Novel Varactors Pair Circuit
- Novel Low-Power Switched Current Matched Filter for DS-CDMA Wireless Communication
- Formation of c-Axis-Oriented Bi_4Ti_3O_ Films with Extremely Flat Surface by Spin-Coating
- Formation of c-Axis-Oriented Bi_4Ti_3O_ Films with Extremely Flat Surface by Spin-Coating
- Comprehensive Study of Plasma Pretreatment Process for Thin Gate Oxide (< 10 nm) Fabricated by Electron Cyclotron Resonance Plasma Oxidation
- A Simple and Efficient Pretreatment Technology for Selective Tungsten Deposition in Low-Pressure Chemical Vapor Deposition Reactor
- Activity Coefficients of Electrons and Holes in Degenerate Semiconductors with Nonuniform Composition
- In-Situ Counting of Process-Induced Particles
- Particle Counting in Semiconductor Processing Gas and Apparatus with a New Flow-Cell-Type Laser Particle Counter
- Single Crystallization of Aluminum on SiO_2 by Thermnal Annealing and Observation with Scanning μ-RHEED Microscope
- Development of Scanning μ-RHEED Microscopy for Imaging Polycrystal Grain Structure in LSI (SOLID STATE DEVICES AND MATERIALS 1)
- High-Rate Deposition of High-Quality Silicon Nitride Film at Room Temperature by Quasi-Remote Plasma Chemical Vapor Deposition
- Improvement of Variable Ratio of On-Chip Variable Inductors Using Side Shield
- A Large Variable Ratio On-Chip Inductor with Spider Legs Shield
- Small-Area Inductor for Silicon CMOS Chips
- Wide Tuning Range LC-VCO Using Variable Inductor for Reconfigurable RF Circuit(Analog Circuit Techniques and Related Topics)
- Small Area Snake Inductor on Si RF CMOS Chip
- On-chip Spiral Inductors Integrated with Wafer-Level Package
- Theoretical Analysis for a New Package Concept : High-Speed Heat Removal for VLSI Using an AlN Heat-Spreading Layer and Microchannel Fin
- Crystal Structure and Microwave Dielectric Properties of CaTiO_3-(Li_N_)TiO_3-(Ln_Nd_)TiO_3 (Ln = La, Dy) Ceramics
- Aluminum Nitride Epitaxially Grown on Silicon: Orientation Relationships
- In Situ Observation of Electromigration in Cu Film Using Scanning μ-Reflection High-Energy Electron Diffraction Microscope
- Planarized Deposition of High-Quality Silicon Dioxide Film by Photoassisted Plasma CVD at 300℃ Using Tetraethyl Orthosilicate
- Evaluation of LaB_6 Thin Film as Low-Work-Function Gate for MOSFET Operated at Low Temperature
- Silicon Nitride Films with Low Hydrogen Content, Low Stress, Low Damage and Stoichiometric Composition by Photo-Assisted Plasma CVD
- Temperature-Scaling Theory for Low-Temperature-Operated MOSFET with Deep-Submicron Channel : Semiconductors and Semiconductor Devices
- Pyrolysis and Photolysis of Trimethylaluminum
- Nondestructive and Noncontact Observation of Microdefects in GaAs Wafers with a New Photo-Thermal-Radiation Microscope
- Nondestructive and Noncontact Observation of Microdefects in GaAs Wafers with a New Photo-Thermal-Radiation Microscope
- Nondestructive and Noncontact Evaluation of Semiconductors by Photothermal Radiometry : Photoacoustic Spectroscopy
- Observation of Nonradiative Processes in Benzene Vapor by Photoacoustic Spectroscopy
- Quasi-Nondestructive Observation of Oxidation-Induced Stacking Faults in Silicon by Photoacoustic Topography
- C-12-23 A Study of Inverter-based RF CMOS Low Noise Amplifier Scalability in CMOS Process
- C-2-82 Broadside 3-dB Tandem Coupler Using WLP Technology for 60 GHz Applications
- Low-Loss Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology(Microwaves, Millimeter-Waves)
- On-Chip Yagi Antenna for Wireless Signal Transmission in Stacked MCP
- Zero-Crosstalk Bus Line Structure for Global Interconnects in Si Ultra Large Scale Integration
- RF Passive Components Using Metal Line on Si CMOS(Analog Circuit and Device Technologies)
- Zero-Crosstalk Bus Line Structure for Global Interconnects in Si ULSI
- Twisted Differential Transmission Line Structure for Global Interconnect in Si LSI
- High-Speed Transmission Circuit for Micro Network on Si ULSI
- Twisted Differential Transmission Line Structure for EMI Noise Reduction at Global Interconnect in Si LSI
- High Density Differential Transmission Line Structure on Si ULSI(Analog Circuit and Device Technologies)
- Statistical Modeling of a Via Distribution for Yield Estimation(Interconnect,VLSI Design and CAD Algorithms)
- Wire Length Distribution Model for System LSI(Interconnect, VLSI Design and CAD Algorithms)
- Evaluation of X Architecture Using Interconnect Length Distribution(Interconnect, VLSI Design and CAD Algorithms)
- Circuit Performance Prediction Considering Core Utilization with Interconnect Length Distribution Model(Prediction and Analysis, VLSI Design and CAD Algorithms)
- Stable Operation of Single Electron Logic Circuits with Feed-Back Loop
- Transmission Electron Microscopic Observation of AlN/α-Al_2O_3 Heteroepitaxial Interface with Initial-Nitriding AlN Layer
- GHz Signal Propagation through Transmission Line on ULSI Chip
- Equivalent Circuit Model for On-Chip Variable Inductor
- Area-Selective Aluminum Patterning Using Atomic Hydrogen Resist
- Low Insertion Loss Surface Acoustic Wave Matched Filter with Low Sidelobe Sequence and Its Application for Spread Spectrum Communication
- Linear Time Calculation of On-Chip Power Distribution Network Capacitance Considering State-Dependence
- Effects of Interfacial States on Electrical Properties of SrBi_2Ta_2O_9 Thin Films
- RF CMOS Integrated Circuit : History, Current Status and Future Prospects
- Matched Filter Type SET Circuit for Room Temperature Operation
- Reliability of Single Electron Transistor Circuits Based on E_b/N_0-Bit Error Rate Characteristics
- Low-Temperature Metal-Oxide-Semiconductor Field-Effect Transistor Operation by Temperature Scaling Theory
- An Inductorless Phase-Locked Loop with Pulse Injection Locking Technique in 90 nm CMOS (集積回路)
- 60-GHz Band Copper Ball Vertical Interconnection for MMW 3-D System-in-Package Front-End Modules
- On-Chip Yagi–Uda Antenna for Horizontal Wireless Signal Transmission in Stacked Multi Chip Packaging
- Optimization Methodology of Layer Numbers with Circuit/Process Co-Design
- Self-Aligned 10-nm Barrier Layer Formation Technology for Fully Self-Aligned Metallization Metal-Oxide-Semiconductor Field-Effect-Transistor
- Physical design challenges to nano-CMOS circuits