Theoretical Analysis for a New Package Concept : High-Speed Heat Removal for VLSI Using an AlN Heat-Spreading Layer and Microchannel Fin
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概要
- 論文の詳細を見る
- 社団法人応用物理学会の論文
- 1991-01-15
著者
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TSUBOUCHI Kazuo
Research Institute of Electrical Communication, Tohoku University
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Mikoshiba Nobuo
Research Institute Of Electrical Communication Tohoku University:(present Address) Hewlett-packard L
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Mikoshiba Nobuo
Research Institute Of Electrical Communication Tohoku University
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Mikoshiba Nobuo
Research Institute Of Electrical Communication Tohoku University:(present Address)hewlett-packard La
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Utsugi Satoshi
Research Institute of Electrical Communication, Tohoku University
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Futatsuya Tomoshi
Research Institute of Electrical Communication, Tohoku University
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Tsubouchi Kazuo
Research Institute Of Electrical Communicaiton Tohoku University
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Utsugi Satoshi
Research Institute Of Electrical Communication Tohoku University
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Futatsuya Tomoshi
Research Institute Of Electrical Communication Tohoku University:(present Address)mitsubishi Electri
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Mikoshiba Nobuo
Research Institute Of Electorical Communication Tohoku University
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TSUBOUCHI Kazuo
Research Institute of Electric Communication (RIEC), Tohoku University
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