Accurate Extraction of Mobility, Effective Channel Length, and Source/Drain Resistance in 60nm MOSFETs
スポンサーリンク
概要
- 論文の詳細を見る
- 2007-09-19
著者
-
Park Byung‐gook
School Of Electrical Engineering Seoul National University
-
Park Byung-gook
School Of Electrical Engineering Seoul National University
-
Lee J
School Of Electrical Engineering Seoul National University
-
Lee J
Inter-university Semiconductor Research Center And School Of Electrical Engineering And Computer Sci
-
Lee Joung-eob
Inter-university Semiconductor Research Center And School Of Electrical Engineering And Computer Sci
-
KIM Jinjoo
School of Electrical Engineering, Seoul National University
-
Kim Jinjoo
School Of Electrical Engineering Seoul National University
-
Shin Hyungcheol
Inter-university Semiconductor Research Center (isrc) And School Of Electrical Engineering And Compu
-
KIM Junsoo
Nano Systems Institutes, and School of EE, Seoul National University
-
LEE Jaehong
Nano Systems Institutes, and School of EE, Seoul National University
-
YUN Yeonam
Nano Systems Institutes, and School of EE, Seoul National University
-
PARK Byung-Gook
Nano Systems Institutes, and School of EE, Seoul National University
-
LEE Jong
Nano Systems Institutes, and School of EE, Seoul National University
-
SHIN Hyungcheol
Nano Systems Institutes, and School of EE, Seoul National University
-
Yun Yeonam
Nano Systems Institutes And School Of Ee Seoul National University
-
Lee Jong
Inter-university Semiconductor Research Center (isrc) And School Of Electrical Engineering Seoul Nat
-
Lee Jong
Inter-university Semiconductor Research Center School Of Electrical Engineering Seoul Nat'l Uni
関連論文
- Side-Gate Design Optimization of 50nm MOSFETs with Electrically Induced Source/Drain
- Characteristic of Dual-Gate Single Electron Transistor (DG-SET) with extended channel using shallow doping and sidewall patterning for suppressing MOS current(Session 9B : Nano-Scale devices and Physics)
- A New Cone-Type 1T DRAM Cell(Session 2A : Memory 1)
- A New Cone-Type 1T DRAM Cell(Session 2A : Memory 1)
- Characteristic of Dual-Gate Single Electron Transistor (DG-SET) with extended channel using shallow doping and sidewall patterning for suppressing MOS current(Session 9B : Nano-Scale devices and Physics)
- Nanoscale Multi-Line Patterning Using Sidewall Structure
- Single-Electron MOS Memory with a Defined Quantum Dot Based on Conventional VLSI Technology
- Single-Electron Transistors with Sidewall Depletion Gates on a Silicon-On-Insulator Nano-Wire
- Single Electron Transistors with Sidewall Depletion Gates on a Silicon-On-Insulator Nano-Wire
- Single Electron Memory with a Defined Poly-Si Dot Based on Conventional VLSI Technology
- Independent Gate Twin-bit SONOS Flash Memory with Split-gate Effect(Session 8A : Memory 2)
- Extraction of Trap Depth in Flash Cell Having Arch-Active Structure
- Design and Simulation of Self-Aligned Vertical Island Single Electron Transistor (VI-SET) with Electrical Tunneling Barrier
- Study on Dependence of Self-Boosting Channel Potential on Device Scale and Doping Concentration in 2-D and 3-D NAND-Type Flash Memory Devices
- Design and Simulation of Self-Aligned Vertical Island Single Electron Transistor (VI-SET) with Electrical Tunneling Barrier
- Study on Dependence of Self-Boosting Channel Potential on Device Scale and Doping Concentration in 2-D and 3-D NAND-Type Flash Memory Devices
- Recessed Channel Dual Gate Single Electron Transistors (RCDG-SETs) for Room Temperature Operation
- Application of the Compact Channel Thermal Noise Model of Short Channel MOSFETs to CMOS RFIC Design
- Charge Injection Path of Bottom-Contact Organic Thin-Film Transistors(Session4B: Emerging Devices II)
- Design of Vertical Nonvolatile Memory Device Considering Gate-Induced Barrier Lowering (GIBL)(Session4A: Nonvolatile Memory)
- 3-dimensional Terraced NAND (3D TNAND) Flash Memory(Session4A: Nonvolatile Memory)
- Recessed Channel Dual Gate Single Electron Transistors (RCDG-SETs) for room temperature operation(Session3: Emerging Devices I)
- Charge Injection Path of Bottom-Contact Organic Thin-Film Transistors(Session4B: Emerging Devices II)
- Design of Vertical Nonvolatile Memory Device Considering Gate-Induced Barrier Lowering (GIBL)(Session4A: Nonvolatile Memory)
- 3-dimensional Terraced NAND (3D TNAND) Flash Memory(Session4A: Nonvolatile Memory)
- Recessed Channel Dual Gate Single Electron Transistors (RCDG-SETs) for room temperature operation(Session3: Emerging Devices I)
- Characterization of 2-bit Recessed Channel Memory with Lifted-Charge Trapping Node (L-CTN) Scheme
- Establishing Read Operation Bias Schemes for 3-D Pillar Structure Flash Memory Devices to Overcome Paired Cell Interference (PCI)
- Self-Aligned Dual-Gate Single-Electron Transistors (DG-SETs)
- An Analytic Current-Voltage Equation for Top-contact OTFTs Including the Effects of Variable Series Resistance
- Spatial Distribution of Channel Thermal Noise in Short-Channel MOSFETs
- Low Hysteresis Organic Thin-Film Transistors and Inverters with Hybrid Gate Dielectric
- Pentacene TFTs Fabricated by High-aspect Ratio Metal Shadow Mask
- Threshold Voltage Roll-off Mechanisms in SONOS Flash Memory in Retention Mode Including Trapped Charge Redistribution Effect(Session 2A : Memory 1)
- Independent Gate Twin-bit SONOS Flash Memory with Split-gate Effect(Session 8A : Memory 2)
- Threshold Voltage Roll-off Mechanisms in SONOS Flash Memory in Retention Mode Including Trapped Charge Redistribution Effect(Session 2A : Memory 1)
- Dual-gate single-electron transistor with silicon nano wire channel and surrounding side gates (Special issue: Solid state devices and materials)
- Multi-level reading method by using PCI (Paired Cell Interference) in vertical NAND flash memory
- Multi-level reading method by using PCI (Paired Cell Interference) in vertical NAND flash memory
- Simulation of Retention Characteristics in Double-Gate Structure Multi-bit SONOS Flash Memory(Session4A: Nonvolatile Memory)
- Simulation of Retention Characteristics in Double-Gate Structure Multi-bit SONOS Flash Memory(Session4A: Nonvolatile Memory)
- Improving the Cell Characteristics Using SiN Liner at Active Edge in 4G NAND Flash
- Establishing read operation bias schemes for 3-D pillar-structure flash memory devices to overcome paired cell interference (PCI) (Electron devices: 第15回先端半導体デバイスの基礎と応用に関するアジア・太平洋ワークショップ(AWAD2007))
- Establishing read operation bias schemes for 3-D pillar-structure flash memory devices to overcome paired cell interference (PCI) (Silicon devices and materials: 第15回先端半導体デバイスの基礎と応用に関するアジア・太平洋ワークショップ(AWAD2007))
- Analyses on Current Characteristics of 3-D MOSFET Determined by Junction Doping Profiles for Nonvolatile Memory Devices(Novel MOSFET Structures,Fundamentals and Applications of Advanced Semiconductor Devices)
- Capacitorless DRAM Cell with Highly Scalable Surrounding Gate Structure
- Analyses on Current Characteristics of 3-D MOSFET Nonvolatile Memory Devices Determined by Junction Doping Profiles(Session 7A Silicon Devices IV,AWAD2006)
- Analyses on Current Characteristics of 3-D MOSFET Nonvolatile Memory Devices Determined by Junction Doping Profiles(Session 7A Silicon Devices IV,AWAD2006)
- Analyses on Current Characteristics of 3-D MOSFET Nonvolatile Memory Devices Determined by Junction Doping Profiles
- 16GHz CMOS LNA design without Source degeneration inductor (先端デバイスの基礎と応用に関するアジアワークショップ(AWAD2005))
- Simulation Study on Dependence of Channel Potential Self-Boosting on Device Scale and Doping Concentration in 2-D and 3-D NAND-Type Flash Memory Devices
- Simulation of Gate-All-Around Tunnel Field-Effect Transistor with an n-Doped Layer
- Simulation of Retention Characteristics in Double-Gate Structure Multi-Bit SONOS Flash Memory
- 3-Dimensional Terraced NAND (3D TNAND) Flash Memory-Stacked Version of Folded NAND Array
- Recessed Channel Dual Gate Single Electron Transistors (RCDG-SETs) for Room Temperature Operation
- Application of the Compact Channel Thermal Noise Model of Short Channel MOSFETs to CMOS RFIC Design
- Characterization of 2-bit Recessed Channel Memory with Lifted-Charge Trapping Node (L-CTN) Scheme
- Establishing Read Operation Bias Schemes for 3-D Pillar Structure Flash Memory Devices to Overcome Paired Cell Interference (PCI)
- FN Stress Induced Degradation on Random Telegraph Signal Noise in Deep Submicron NMOSFETs
- Full-swing pentacene organic inverter with long-channel driver and short-channel load
- Complementary Self-Biased Logics Based on Single-Electron Transistor (SET)/CMOS Hybrid Process
- A Highly Scalable Split-Gate SONOS Flash Memory with Programmable-Pass and Pure-Select Transistors for Sub-90-nm Technology
- Silicon Quantum Tunneling Devices - FIBTET and MOSET
- Channel Doping Engineering with Indium as an Alternative p-Type Dopant
- Investigating programming motivation sources from student behavior (教育工学)
- Design and Simulation of Asymmetric MOSFETs(Junction Formation and TFT Reliability,Fundamentals and Applications of Advanced Semiconductor Devices)
- Novel Gate-All-Around MOSFETs with Self-Aligned Structure
- Multi-Functionality of Novel Structured Tunneling Devices
- Accurate Extraction of the Trap Depth from RTS Noise Data by Including Poly Depletion Effect and Surface Potential Variation in MOSFETs(Ultra-Thin Gate Insulators,Fundamentals and Applications of Advanced Semiconductor Devices)
- Synchronous Mirror Delay for Multi-phase Locking
- Synchronous Mirror Delay for Multi-phase Locking
- Junction Leakage Characteristics of Shallow Trench Isolation (STI) with Nitrogen Pile-Up Sidewall Oxide(AWAD2003 : Asia-Pacific Workshop on Fundamental and Application of Advanced Semiconductor Devices)
- Junction Leakage Characteristics of Shallow Trench Isolation (STI) with Nitrogen Pile-Up Sidewall Oxide(AWAD2003 (Asia-Pacific Workshop on Fundamental and Application of Advanced Semiconductor Devices))
- Design and Simulation of Asymmetric MOSFETs(Session 7A Silicon Devices IV,AWAD2006)
- Design and Simulation of Asymmetric MOSFETs(Session 7A Silicon Devices IV,AWAD2006)
- Design and Simulation of Asymmetric MOSFETs
- Integration Process of Impact-Ionization Metal-Oxide-Semiconductor Devices with Tunneling Field-Effect-Transistors and Metal-Oxide-Semiconductor Field-Effect Transistors
- Reverse-Order Source/Drain with Double Offset Spacer (RODOS) for Sub-50nm Low-Power and High-Speed MOSFET Design (AWAD2003 (Asia-Pacific Workshop on Fundamental and Application of Advanced Semiconductor Devices))
- Side-Gate Design for 50nm Electrically Induced Source/Drain MOSFETs
- Design Consideration for Vertical Nonvolatile Memory Device Regarding Gate-Induced Barrier Lowering (GIBL)
- Accurate Extraction of Mobility, Effective Channel Length, and Source/Drain Resistance in 60nm MOSFETs
- Design and simulation of single hole transistor with tunneling barrier formed by fixed charge (Electron devices: 第15回先端半導体デバイスの基礎と応用に関するアジア・太平洋ワークショップ(AWAD2007))
- Design and simulation of single hole transistor with tunneling barrier formed by fixed charge (Silicon devices and materials: 第15回先端半導体デバイスの基礎と応用に関するアジア・太平洋ワークショップ(AWAD2007))
- Properties of the p^+ poly-Si Gate Fabricated Using the As Preamorphization Method
- As Preamorphization of the Predeposited Amorphous Si Layer for the Formation of the Silicided Ultra Shallow p^+-n Junction
- RF Linearity Analysis of FinFETs using 3-D Device Simulation (先端デバイスの基礎と応用に関するアジアワークショップ(AWAD2005))
- RF Linearity Analysis of FinFETs using 3-D Device Simulation (先端デバイスの基礎と応用に関するアジアワークショップ(AWAD2005))
- Electronic Structure Simulation of Chromium Aluminum Oxynitride by Discrete Variational-Xa Method and X-Ray Photoelectron Spectroscopy
- Lateral Silicon Field-Emission Devices using EIectron Beam Lithography
- Silicon Nano-Crystal Memory with Tunneling Nitride
- Metal FEAs Fabricated with Local Oxidation of Polysilicon for Large-Area Display Applications
- Metal FEAs Fabricated with Local Oxidation of Polysilicon for Large-Area Display Applications
- Monte Carlo Simulation of Single-Electron Nanocrystal Memories
- 4-bit FinFET SONOS flash memory: Optimization of structure and 3D numerical simulation (Electron devices: 第15回先端半導体デバイスの基礎と応用に関するアジア・太平洋ワークショップ(AWAD2007))
- 4-bit FinFET SONOS flash memory: Optimization of structure and 3D numerical simulation (Silicon devices and materials: 第15回先端半導体デバイスの基礎と応用に関するアジア・太平洋ワークショップ(AWAD2007))
- A New 1T DRAM Cell : Cone Type 1T DRAM Cell
- Effects of Conductive Defects on Unipolar RRAM for the Improvement of Resistive Switching Characteristics
- Novel Three Dimensional (3D) NAND Flash Memory Array Having Tied Bit-line and Ground Select Transistor (TiGer)
- Comparative Study on Top- and Bottom-Source Vertical-Channel Tunnel Field-Effect Transistors
- Study on Threshold Voltage Control of Tunnel Field-Effect Transistors Using V_T-Control Doping Region