315 繰り返し負荷を受ける微細四角形貫通孔形成銅めっき膜の結晶成長メカニズム(OS2-3 皮膜・薄膜の環境強度,OS2 薄膜・皮膜とその膜構造の特性評価)

概要

論文の詳細を見る
In order to improve the sensitivity of stress measurement using an electroplated copper film, the mechanism of micro texture change of an electroplated copper thin film with a small square slit was discussed by observing the change of the film surface and by finite element analysis under an uni-axial loading. The electroplated film consisted of columnar structure with a diameter of about 0.5 μm and showed anisotropic mechanical properties. The recrystallization of the film started at the corner of the square slit and the change of the micro texture occurred only around the free surface of the film. This is because that the maximum strain due to the uni-axial loading appeared near the free surface of the film with a square slit.
一般社団法人日本機械学会の論文
2007-10-24