1924 銅薄膜配線の微細組織と機械的特性評価(J16-3 電子情報機器,電子デバイスの熱制御と強度・信頼性評価(3),J16 電子情報機器,電子デバイスの熱制御と強度・信頼性評価)

概要

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Electroplated Cu thin films have begun to be used for thin film interconnections of semiconductor devices. Since mechanical properties of Cu thin films strongly depend on their micro structure, their properties can be controlled by controlling their micro structures. So, mechanical properties of patterned electroplated Cu thin films and plain Cu films were measured by nanoindentation technique. It was found that there was a clear indentation-depth dependence of Young's modulus of those films. In addition, the absolute value and the fluctuation of the measured values also varied drastically among those films depending on electroplating conditions.
社団法人日本機械学会の論文
2007-09-07