実験計画法を用いたボンディングワイヤループ形状適正化の検討(J01-4 最適構造設計,J01 エレクトロニクス実装における熱制御および信頼性評価)

概要

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A method for evaluating fatigue life of the bonding wires in semiconductor packages under a temperature cycling test was studied analytically using a finite element method based on design of experiments. The sensitivity analysis of the maximum strain occurs in a bonding wire was carried out to make clear the effect of the loop-shape of the wire on the strain. It was found that we can evaluate the fatigue life of a bonding wire under various conditions of a temperature cycling test at the early stage of design by using both the Chebyshev function of a loop, shape factor and the Manson-Coffin fatigue life curve. It was also found that highly reliable loop shape of the wire can be designed by minimizing the strain using design of experiments.
社団法人日本機械学会の論文
2004-09-04