銅メッキ膜応力測定法における微細スリット形状の最適化(S05-4 薄膜・微細構造物の機械特性評価,S05 薄膜の強度物性と信頼性)

概要

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Effect of structure of a micro slit formed in an electroplated copper film on the stress and strain fields at a tip of the slit was analyzed using a finite element method to improve the sensitivity of the stress measurement applying the film. When a penetrating slit is formed in the film, the maximum principal strain occurs at a surface of the film, while it occurs at the interface between the film and a substrate before the slit formation. The maximum principal strain at the slit tip increased drastically with increase of the film thickness and decrease of the tip angle of the slit. However, it did not change so much when the both length and width of the slit were changed. It is possible to improve the sensitivity of the stress measurement from about 100 MPa to about 10 MPa by optimizing the slit structure.
社団法人日本機械学会の論文
2004-09-04