J0601-3-1 めっき銅薄膜配線の強度信頼性に及ぼす微細組織の影響([J0601-3]電子情報機器,電子デバイスの強度・信頼性評価と熱制御(3))

概要

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Mechanical properties of the electroplated copper thin films, such as Young's modulus and the tensile strength were found to vary drastically comparing with those of the conventional bulk material. The reason for the variation of these mechanical properties was that the electroplated copper thin films mainly consisted of fine columnar grains with the diameter of a few hundred nm and the height of about a few urn. In this study, effects of brittle and porous grain boundaries which caused brittle fracture were discussed experimentally. The authors conducted fatigue tests of annealed films to clarify the relationship between their fatigue strength and microstructure including grain boundaries and grain size. In addition, their grain boundaries were evaluated by measurement of crystal orientation based on EBSD (Electron Back Scatter Diffraction). It was found that the crack propagation path during a fatigue test was dominated by the crystallinity of the grain boundaries. The crystallinity of the grain boundaries changed drastically depending the thermal history of the films after electroplating.
一般社団法人日本機械学会の論文
2010-09-04