シリカ粒子充てんエポキシ樹脂の応力特異場理論による強度評価の検討

概要

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Epoxy resins used for encapsulation of integrated circuit(IC)devices are filled with silica particles to reduce the thermal expansion coefficient and to improve the thermal conductivity.We investigated a method for estimating lifetime of cracking of epoxy resins filled with silica particles near the stress singular point.The flexural strength of the resins was measured by using the 4-point bending test on the notched specimens, and the stress distribution near the notch edges was analyzed by using a finite element method.The stress distribution curves obtained from both the particulate-filled epoxy resins and the unfilled epoxy resins with various stress singularity factor(λ)intersected one after another at a specific distance from the stress singular point.The specific distance of particulate-filled epoxy resins varied depending on the volume fraction of the added particle, the diameter of the particle and the adhesion strength at the particle-matrix interface.This specific distance was related to the plastic zone size of the matrix resin.
社団法人日本材料学会の論文
2000-04-15