707 応力-拡散解析を用いた錫ウィスカ成長に及ぼす結晶粒形状の影響評価(OS4.電子デバイス・電子材料と計算力学(1),オーガナイズドセッション)

概要

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To evaluate the effects of grain shape on tin whisker growth, stress-diffusion analysis is performed. This simulation uses the finite element method (FEM), molecular dynamics simulation, and X-ray diffraction (XRD). An FEM model considering the elastic anisotropy, thermal expansion anisotropy, mass diffusion, and crystal orientation of β-tin is developed. Two models that have different crystal orientation distributions are evaluated. Both models have the same grain shape as an SEM image of the tin plating surface. It is revealed that the concentration of the tin plating surface is affected by crystal orientation rather than crystal grain shape.
2008-11-01