累積損傷モデルに基づく疲労き裂進展特性の推定方法

概要

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We previously developed a crack propagation model to calculate crack paths using accumulated damage in microsolder joints in semiconductor structures. We have now developed a method based on the crack propagation model, which is named accumulated damage model, to predict fatigue-crack propagation properties of solders. Generally, there is a correlation between crack propagation rates, da/dN, of solders and J-integral ranges, ⊿ J. The correlation can be represented in an equation as a simple power relationship, given by da/dN=B[⊿ J]^q. We derive this simple power equation from our crack propagation model and Hutchinson-Rice-Rosengren singularity theory. The equation enabled us to estimate fatigue-crack propagation properties from cyclic stress-strain curves and fatigue strength properties. We used the method to predict fatigue-crack propagation properties for center-cracked plate specimens made of Sn-40Pb and Sn-3.5Ag-1Cu. The predictions agreed well with actual fatigue-crack propagation properties detemined by experiment for center-cracked plate specimens made of Sn-40Pb and Sn-3.5Ag-1Cu, indicating that our method effectively predicts solder fatigue-crack propagation properties.
社団法人日本機械学会の論文
2008-04-25