はんだリフロー工程で発生するICのパッケージクラックに関する研究 : 第3報,素子接着剤層の影響

概要

論文の詳細を見る
If surface mounted IC packages contain absorbed moisture, the vapor pressure generated inside the package when they are heated during the reflow soldering process may cause cracking. Our earlier report described how this vapor pressure could be determined by 1-dimensional analysis of the moisture diffusion in the plastic below the chip pad. Because package cracking due to moisture absorbed in the chip bonding paste has recently elicited of wide interest, we performed a 2-dimensional analysis of moisture diffusion in the plastic and in the paste. Using the method proposed in a previous report, we evaluated the strength of the plastic according to three types of models of the cracking mechanism. The present analysis investigates how package cracking is influenced by moisture absorbed into the paste.
社団法人日本機械学会の論文
1994-02-25