数値制御プラズマCVMによる水晶ウエハの高精度加工に関する研究 : 回転電極とパイプ電極を併用した数値制御加工による水晶ウエハ厚さの均一化

概要

論文の詳細を見る
To improve the thickness uniformity of thin quartz crystal wafer, new machining process applying numerically controlled plasma CVM was developed. In this process, thickness distribution of the quartz crystal wafer was improved by two-step correction process which utilizes both a cylindrical shaped rotary electrode and a pipe electrode. Firstly, long spatial wavelength component of the thickness error is corrected by using the rotary electrode. And secondly, short wavelength component is corrected by using small size pipe electrode. By adopting the two-step correcting process, thickness distribution of an AT cut wafer was improved from 108nm (p-v: peak to valley) to 14nm (p-v). And the spurious mode in the resonance curve was reduced by improving the parallelism of the quartz crystal wafer.
社団法人精密工学会の論文
2006-07-05