The Enhanced and Suppressed Electroless Plating of Copper by UV-Irradiation : Chemistry (incl. physical process)
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概要
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The effect of irradiation of ultraviolet (UV) light from a low pressure mercury lamp on the copper electroless plating process has been investigated. Both enhancement of the plating rate and the opposite effect of suppression are obtained. It is possible to make copper film pattern by these effects with resolving power of 50 μm.
- 社団法人応用物理学会の論文
- 1988-09-20
著者
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Ishikawa Y
Dowa Mining Co. Ltd. Tokyo
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Gamo Kenji
Faculty Of Engineering Science And Research Center For Extreme Materials Osaka University
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Ishikawa Yutaka
Department Of Electrical And Electronics Engineering Nippon Institute Of Technology
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Nakamichi Ichiro
Department Of Electrical And Electronics Engineering Nippon Institute Of Technology
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Namba Susumu
Faculty Of Engineering Science And Research Center For Extreme Materials (rcem) Osaka University
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