Low-Temperature Oxidation of Silicon in Dry O_2 Ambient by UV-lrradiation
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概要
- 論文の詳細を見る
The mechanism of thermal oxidation of silicon in dry O_2 ambient with UV-irradiation has been discussed. The dependence of SiO_2 thickness on oxidation time follows the model proposed by Cabrera and Mott for relatively short oxidation time. Such dependence follows the model by Deal and Grove for longer time. The main oxidizing species is ozone (O_3) or some other reactive species generated from O_3 at lower temperatures and this gradually changes to O_2 with an increase in temperature. The SiO_2 film formed at 5OO℃ for 1 h by the present technique has a similar quality to that of SiO_2 formed at high temperatures in dry O_2 ambient, as eva1uated from Fourier Transform-Infrared (FT-IR), Auger Electron Spectroscopy (AES) and Capacitance-Voltage (C-V) characteristics.
- 社団法人応用物理学会の論文
- 1992-04-15
著者
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Ishikawa Y
Research Center For Interface Quantum Electronics And Graduate School Of Electronics And Information
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Ishikawa Y
Dowa Mining Co. Ltd. Tokyo
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Ishikawa Y
Hokkaido Univ. Sapporo Jpn
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Ishikawa Yutaka
Department Of Electrical And Electronics Engineering Nippon Institute Of Technology
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Nakamichi Ichiro
Department Of Electrical And Electronics Engineering Nippon Institute Of Technology
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Nakamichi Ichiro
Department Of Electro And Electronics Engineering Nippon Institute Of Technology
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Nakamichi I
Department Of Electrical And Electronics Engineering Nippon Institute Of Technology
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SHIBAMOTO Tsuyoshi
Department of Electrical and Electronics Engineering, Nippon Institute of Technology
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Shibamoto Tsuyoshi
Department Of Electrical And Electronics Engineering Nippon Institute Of Technology
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