The Output Power Enhancements of GaN-Based Blue Light-Emitting Diodes with Highly Reflective Ag/Cr/Au Trilayer Omnidirectional Reflective Electrode Pads
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概要
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In this study, we demonstrated the fabrication of GaN-based light-emitting diodes (LEDs) on a patterned sapphire substrate (PSS) or non-PSS with nonalloy Ag/Cr/Au trilayer metal electrode pads on the exposed n+-GaN and indium tin oxide layers to be the n-type electrode and p-type electrode, respectively. The forward voltages of all LED samples at 20 mA were in the range of 3.1–3.2 V and were sufficiently low compared with those of commercial GaN-based LEDs. In the present experiment, the 20 mA output power of GaN-based LEDs with Ag/Cr/Au trilayer electrode bonding pads can be increased by a magnitude of 17% compared with those of the conventional LEDs with nonalloy Cr/Au bonding pads. Moreover, the 20 mA output power of GaN-based LEDs will be increased by more than 40 and 11% by introducing PSS and Ag/Cr/Au trilayer electrode bonding pads compared with those of the conventional LEDs and PSS LEDs, respectively, with nonalloy Cr/Au bonding pads.
- 2009-10-25
著者
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Lai Wei-chih
Institute Of Electro-optical Science And Engineering National Cheng Kung University
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Chang Shoou-jinn
Institute Of Electro-optical Science And Engineering Center For Micro/nano Science And Technology Na
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Shei Shih-chang
Department Of Electrical Engineering National Cheng Kung University
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Sheu Jinn-Kong
Institute of Electro-Optical Science and Engineering and Advanced Optoelectronic Technology Center and Center for Micro/Nano Science and Technology, National Cheng Kung University, Tainan, Taiwan 701, Republic of China
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Lai Wei-Chih
Institute of Electro-Optical Science and Engineering, National Cheng Kung University, Tainan 70101, Taiwan
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Shei Shih-Chang
Department of Electronic Engineering, National University of Tainan, Tainan 700, Taiwan
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Hung I-Hsiu
Institute of Electro-Optical Science and Engineering, National Cheng Kung University, Tainan 70101, Taiwan
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Chang Shoou-Jinn
Institute of Microelectronics and the Department of Electrical Engineering, National Cheng Kung University, Tainan 70101, Taiwan
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