726 損傷パスシミュレーションによるSn-37Pbはんだのき裂進展評価(GS.A 先端材料の破壊と強度)

概要

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Fatigue life prediction of solder joints is one of the most important areas of research in the development of reliable electronic packages. In the present days, a new method of estimating the crack propagation, which was based on finite element analysis without geometric crack model, was examined. On the basis of damage model for solder, the new method called 'damage path simulation' was verified for CT specimens of Sn-37Pb solder. The extensions of damage path in the cases of different mesh sizes and element types were compared. The extensions of damage path showed comparatively good agreement with the behavior of the crack propagation observed in the fatigue tests using CT specimens, in the case that the mesh size was comparable to the grain size of solder.
一般社団法人日本機械学会の論文
2007-10-24