シリカ粒子充てんエポキシ樹脂の破壊靱性に及ぼす温度の影響

概要

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Silica-particulate-filled epoxide resins are used as encapsulant materials in semiconductor packaging. In the present paper. the effects of temperature on the fracture toughness of two types of epoxide resin containing 70 wt.% silica particles have been studied. The bridge indentation method was employed in pre-cracking of the specimens, and three point bending tests were carried out to obtain fracture toughness. The fracture toughness of both resins was almost constant at the temperatures from room temperature to the glass transition temperature of the resin. The fracture toughness decreased remarkably above the glass transition temperature. Fracture surface observation by scanning electron microscope shows that epoxide resin matrix predominates in the fracture surface at temperatures above the glass transition temperature while cracking of silica particles is seen at room temperature. This suggests that differences in fracture toughness due to temperature are attributable to differences in crack propagation of the resin due to softening of the resin matrix above the glass transition temperature.
一般社団法人日本機械学会の論文
1999-12-25