シリカ粒子充てんエポキシ樹脂の破壊靭性試験法と破壊特性に及ぼす吸湿の影響

概要

論文の詳細を見る
Silica-particulate-filled epoxide resins are used as encapsulant materials in semiconductor packaging. In the present paper, the effects of moisture absorption on the bending strength and fracture toughness of two types of the epoxide resins containing 70wt.% silica particles have been studied. The bridge indentation method was employed in precracking of specimens. The fracture toughness obtained agreed well with the results of fatigue precracked specimens. The fracture toughness of both resins slightly increased with moisture absorption while the bending strength tended to decrease. Fracture surface observation by scanning laser microscope shows that debonding of the interface between silica and epoxy predominates in the fracture surface of the bonding specimens while cracking of silica particles triggers the fracture of the precracked specimen. It is suggested that differences in bending strength and fracture toughness due to moisture absorption are attributable to differences in the stress triaxiality of the specimens.
一般社団法人日本機械学会の論文
1996-04-25