はんだバンプ接合部の損傷パスシミュレーション : 機械的疲労試験条件での適用性検討

概要

論文の詳細を見る
Fatigue life prediction of solder joints is one of the most important areas of research in the development of reliable electronic packages. In the present study, the new method of estimating the crack propagation, called 'damage path simulation', was applied for solder bumps under the mechanical fatigue tests. The new method is based on finite element analysis without geometrical crack model, and on the characteristic damage model assumed for solder. Damage paths from the entire circumference in the vicinity of the interface were simulated, and they were finally combined at the center of bumps. The extension of the damage path showed good agreement with the behavior of crack propagation observed in the mechanical fatigue tests. In the case of solder bumps, the effects of the assessment of the previous damage on the extension rate of the damage path might be critical issue. However, the effects of the assessment of the previous damage were relatively small, in consideration of the large scattering in the results of mechanical fatigue tests. It was confirmed that the number of cycles to the fatal failure of solder bumps can be accurately estimated by the damage path simulation. It was concluded that the estimation of the crack propagation based on the proposed method is satisfactory for engineering purposes.
社団法人日本機械学会の論文
2007-12-25