3557 鉛フリーはんだの強度特性のひずみ速度依存性に関する検討(S23-2 弾性・塑性・粘塑性特性,S23 電子実装用はんだの強度特性評価)

概要

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Evaluation of reliability for the impact strength of solder joints have been coming an important issue related to the miniaturization, lightweight and multi-functionalization of portable information equipments. However, there are few data about the deformation characteristic and the strength property of lead-free solder at the high strain rate, which can be used as the basic data of stress analysis. In this study, the tensile tests at room temperature and 125℃ were carried out for Sn-3.OAg-0.5Cu lead-free solder, in order to investigate the tensile property in the strain range from low strain rate to high strain rate. As a result, it was found that the tensile strength increases with the increase in strain rate.
一般社団法人日本機械学会の論文
2006-09-15