1115 パワーデバイスパッケージの強度・熱協調設計(J08-3 電子情報機器,電子デバイスの強度・信頼性評価と熱制御(3) 基板・部品の特性評価,ジョイントセッション,21世紀地球環境革命の機械工学:人・マイクロナノ・エネルギー・環境)

概要

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The present trend of power device packages indicates that there is strong customer demand for utilization of several driving circuits and compact packaging with sufficiently high reliability. The mechanical reliability is highly dependent on mechanical packaging technology, which includes cooling techniques and material strength characteristics. The use of cooling systems for a power device package is not only to keep the device temperature below a critical value, but also to control the solder strain caused by thermal expansion. In the present study, the design of a power device package that had a robust thermal property against the manufacturing error was completed. The material selection and the component dimension of the package were determined by examining the solder strain as the result of the thermal expansion difference, the thermal resistance and the variance of these design objects.
社団法人日本機械学会の論文
2008-08-02