Lifetime Improvement of Organic Light Emitting Diodes using LiF Thin Film and UV Glue Encapsulation
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概要
- 論文の詳細を見る
This work demonstrates the use of lithium fluoride (LiF) as a passivation layer and a newly developed UV glue for encapsulation on the LiF passivation layer to enhance the stability of organic light-emitting devices (OLEDs). Devices with double protective layers showed a 25-fold increase in operational lifetime compared to those without any packaging layers. LiF has a low melting point and insulating characteristics and it can be adapted as both a protective layer and pre-encapsulation film. The newly developed UV glue has a fast curing time of only 6 s and can be directly spin-coated onto the surface of the LiF passivation layer. The LiF thin film plus spin-coated UV glue is a simple packaging method that reduces the fabrication costs of OLEDs.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2008-07-25
著者
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Tsai Yu-sheng
Institute Of Electro-optical And Materials Science National Formosa University
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Chen Wen-ray
Department Of Electronic Engineering National Formosa University
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Huang Bohr-ran
Graduate School Of Engineering Science And Technology National Yunlin University Of Science And Tech
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Juang Fuh-shyang
Institute Of Electro-optical And Materials Science National Formosa University
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Hsieh Tsung-eong
Department Of Materials Science And Engineering National Chiao Tung University
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Su Yan-kuin
Institute Of Electro-optical Science And Engineering Advance Optoelectronics Technology Center Natio
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Hsieh Tsung-Eong
Department of Materials Science and Engineering, National Chiao-Tung University, Hsinchu 30010, Taiwan
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Wang Shun-Hsi
Institute of Electro-optical and Materials Science, National Formosa University, Huwei, Yunlin 632, Taiwan
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Wang Shun-Hsi
Institute of Electro-optical and Materials Science, National Formosa University, 64 Wunhua Road, Huwei, Yunlin 632-08, Taiwan
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Huang Jian-Ji
Institute of Microelectronics and Department of Electrical Engineering, National Cheng Kung University, Tainan 701, Taiwan
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Chang Ming-Hua
Department of Materials Science and Engineering, National Chiao-Tung University, Hsinchu 30010, Taiwan
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Hsieh Huai-En
Graduate School of Optoelectronics Engineering, National Yunlin University of Science and Technology, Yunlin 640, Taiwan
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Liu Mark
Material and Chemical Research Laboratories, Industrial Technology Research Institute, Hsinchu 300, Taiwan
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Tsai Yu-Sheng
Institute of Electro-Optical and Materials Science, National Formosa University, Huwei, Yunlin 632, Taiwan
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Chang Ming-Hua
Department of Material Science and Engineering, National Chiao Tung University, Hsinchu 300, Taiwan
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Chen Wen-Ray
Department of Electrical Engineering, Southern Taiwan University of Technology, Tainan 710, Taiwan, R.O.C.
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Huang Bohr-Ran
Graduate Institute of Electro-Optical Engineering and Department of Electronic Engineering, National Taiwan University of Science and Technology, Taipei 106, Taiwan
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Chen Wen-Ray
Department of Electronic Engineering, National Formosa University, Huwei, Yunlin 632, Taiwan
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Juang Fuh-Shyang
Institute of Electro-Optical and Materials Science, National Formosa University, Huwei, Yunlin 632, Taiwan
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Hsieh Tsung-Eong
Department of Material Science and Engineering, National Chiao Tung University, Hsinchu 300, Taiwan
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Juang Fuh-Shyang
Institute of Electo-optical and Materials Science, National Formosa University, 64 Wunhua Road, Huwei, Yunlin 632-08, Taiwan
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Su Yan-Kuin
Institute of Microelectronics and Department of Electrical Engineering, National Cheng Kung University, Tainan 701, Taiwan
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