Interface Modification in Organic Thin Film Transistors

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概要

• 論文の詳細を見る

• The octadecyltrichlorosilane (OTS) solutions with three solvents, hexadecane, toluene, and ethanol, were acted as the interface chemical modifiers to advance the characteristics of organic thin-film transistors (OTFTs). The electrical characteristics of the organic thin-film transistors with modification were obviously enhanced, especially in mobility, on/off current ratio and subthreshold slope. From the data of X-ray diffraction (XRD), contact angle and atomic force microscope (AFM) measurement, it could be understood that the quality of the organic thin film had been improved due to the change of silicon dioxide surface energy. In this report, the best device was been treated in the OTS/toluene or hexadecane solutions with 1% volume concentration.

• Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
• 2005-04-15

著者

• WU Bo-Tan

  Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University

• TU Ming-Lung

  Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University

• WANG An-Chang

  Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University

• CHEN You-Sian

  Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University

• Chu Chun-hsun

  Industrial Technology Research Institute Electronics Research And Service Organization Advanced Pack

• Chiou Yu-zung

  Department Of Electrical Engineering National Cheng Kung University

• Chiou Yii-tay

  Industrial Technology Research Institute Electronics Research And Service Organization Advanced Pack

• Su Yan-kuin

  Institute Of Electro-optical Science And Engineering Advance Optoelectronics Technology Center Natio

• Chu Chun-Hsun

  Industrial Technology Research Institute, Electronics Research and Service Organization, Advanced Packaging Technology Center

• CHIOU Yii-Tay

  Industrial Technology Research Institute, Electronics Research and Service Organization, Advanced Packaging Technology Center

• Wang An-Chang

  Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University, Tainan 701, Taiwan

• Tu Ming-Lung

  Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University, Tainan 701, Taiwan

• Chiou Yu-Zung

  Department of Electronics Engineering, Southern Taiwan University of Technology, Tainan 701, Taiwan

• Su Yan-Kuin

  Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University, Tainan 701, Taiwan

• Wu Bo-Tan

  Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University, Tainan 701, Taiwan

• Chen You-Sian

  Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University, Tainan 701, Taiwan

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