Effects of Interfacial Oxide Layer for the Ta_2O_5 Capacitor After High-Temperature Annealing
スポンサーリンク
概要
- 論文の詳細を見る
Thin Ta_2O_5 films were prepared by low-pressure chemical vapor deposition (LPCVD) and subsequently annealed in O_2 ambient at various temperatures. It was found that the leakage current of the Ta_2O_5/SiO_x capacitor was controlled by the Ta_2O_5 layer when the annealing temperature was lower than 700℃. On the other hand, the leakage current was controlled by the interfacial oxide layer when the annealing temperature was higher than 700℃. It was also found that we could achieve an equivalent thin oxide thickness and a small leakage current at the same time from the Ta_2O_5/SiO_x capacitor with a suitable thermal annealing treatment. [DOI: 10.1143/JJAP.41.690]
- 社団法人応用物理学会の論文
- 2002-02-15
著者
-
CHANG Shoou
Institute of Microelectronics, Department of Electrical Engineering, National Cheng Kung University
-
CHEN Jone
Institute of Microelectronics and Department of Electrical Engineering, National Cheng Kung Universi
-
LIU Chun
Department of Environmental Chemistry and Engineering, Interdisciplinary Graduate School of Science
-
Chen Jone
Institute Of Microelectronics & Department Of Electrical Engineering National Cheng Kung Univers
-
Chang Shoou
Institute Of Microelectronics & Department Of Electrical Engineering National Cheng Kung Univers
-
Liaw Uang
Department Of Electronic Engineering Chin-min College
-
Liu Chun
Department Of Electronic Engineering Nan-jeon Institute Of Technology Yan-hsui
-
Chang Shoou
Institute Of Microelectronics & Department Of Electrical Engineering Center For Micro/nano Scien
-
SUN Shi
R&D, Wafertech
-
LEE Jiann
Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University
-
Lee Jiann
Institute Of Microelectronics & Department Of Electrical Engineering National Cheng Kung Univers
-
Sun Shi
R&d Taiwan Semiconductor Manufacturing Company
-
LIU Chun
Department of Electrical Engineering, National Cheng Kung University
関連論文
- P-Type Enhancement-Mode SiGe Doped-Channel Field-Effect Transistor
- A Novel Triple δ-Doped SiGe Heterostructure Field-Effect Transistor
- Transparent TiN Electrodes in GaN Metal-Semiconductor-Metal Ultraviolet Photodetectors(Semiconductors)
- On the Carrier Concentration and Hall Mobility in GaN Epilayers : Semiconductors
- Anomalous Hot-Carrier-Induced On-Resistance Degradation in High-Voltage LDMOS Transistors
- Mechanism and Reliability Index of Hot-Carrier Degradation in LDMOS Transistors
- Hot-Carrier Reliability Improvement in Submicron High-Voltage DMOS Transistors
- Absorption and Desorption Behavior of Ammonia with Alkali Earth Halide and Mixed Halide
- Onsager Principle and Electrorheological Fluid Dynamics(Non Equilibrium Soft Matter)
- GaN-Based Light Emitting Diodes with Si-Doped In_Ga_N/GaN Short Period Superlattice Current Spreading Layer
- Effect of Mobility Degradation and Supply Voltage on NBTI Induced Drain Current Degradation
- Low Temperature Activation of Mg-Doped GaN in O_2 Ambient : Semiconductors
- Vertical High Quality Mirrorlike Facet of GaN-Based Device by Reactive Ion Etching
- ZnMgSSe Metal-Semiconductor-Metal Visible-Blind Photodetectors with Transparent Indium-Tin-Oxide Contact Electrodes : Semiconductors
- Investigation of Transport Mechanism for Strained Si n Metal-Oxide-Semiconductor Field-Effect Transistor Grown on Multi-Layer Substrate
- Investigation of Impact Ionization in Strained-Si nMOSFETs
- Characterization of Tungsten Carbide as Diffusion Barrier for Cu Metallization
- Effects of Interfacial Oxide Layer for the Ta_2O_5 Capacitor After High-Temperature Annealing
- Surface Characteristics, Optical and Electrical Properties on Sol-Gel Synthesized Sn-Doped ZnO Thin Film
- Effect of Atomic Layer Epitaxy Growth Conditions on the Properties of ZnS Epilayers on (100)-Si Substrate
- Characteristics and Improvement in Hot-Carrier Reliability of Sub-Micrometer High-Voltage Double Diffused Drain Metal–Oxide–Semiconductor Field-Effect Transistors
- Tolerance Design of Passive Filter Circuits Using Genetic Programming(Electronic Circuits)
- Atomic Layer Epitaxy of ZnS by Low-Pressure Horizontal Metalorganic Chemical Vapor Deposition
- Mechanism and Modeling of On-Resistance Degradation in n-Type Lateral Diffused Metal–Oxide–Semiconductor Transistors
- Vertical High Quality Mirrorlike Facet of GaN-Based Device by Reactive Ion Etching
- Characterization of Oxide Tarps in 28 nm p-Type Metal--Oxide--Semiconductor Field-Effect Transistors with Tip-Shaped SiGe Source/Drain Based on Random Telegraph Noise
- Impact of SiN on Performance in Novel Complementary Metal–Oxide–Semiconductor Architecture Using Substrate Strained-SiGe and Mechanical Strained-Si Technology
- An Investigation on Hot-Carrier Reliability and Degradation Index in Lateral Diffused Metal–Oxide–Semiconductor Field-Effect Transistors
- P-Type Enhancement-Mode SiGe Doped-Channel Field-Effect Transistor
- Characterization of Tungsten Carbide as Diffusion Barrier for Cu Metallization
- Investigation of Hot-Carrier-Induced Degradation Mechanisms in p-Type High-Voltage Drain Extended Metal–Oxide–Semiconductor Transistors
- Effect of Gate Voltage on Hot-Carrier-Induced On-Resistance Degradation in High-Voltage n-Type Lateral Diffused Metal–Oxide–Semiconductor Transistors
- Evaluation of Interface Property and DC Characteristics Enhancement in Nanoscale n-Channel Metal–Oxide–Semiconductor Field-Effect Transistor Using Stress Memorization Technique
- Characteristics of Lateral Diffused Metal--Oxide--Semiconductor Transistors with Lightly Doped Drain Implantation through Gradual Screen Oxide
- GaN-Based Light Emitting Diodes with Si-Doped In0.23Ga0.77N/GaN Short Period Superlattice Current Spreading Layer
- Hole Confinement and $1/ f$ Noise Characteristics of SiGe Double-Quantum-Well p-Type Metal–Oxide–Semiconductor Field-Effect Transistors
- Characteristics of Sub-50 nm NAND Flash Devices with Various Self-Aligned Shallow Trench Isolation Depths
- Atomic Layer Epitaxy of ZnS by Low-Pressure Horizontal Metalorganic Chemical Vapor Deposition
- Impact of Mobility Degradation and Supply Voltage on Negative-Bias Temperature Instability in Advanced p-Channel Metal–Oxide–Semiconductor Field-Effect Transistors
- Characteristics of Sub-50 nm NAND Flash Devices with Various Self-Aligned Shallow Trench Isolation Depths (Special Issue : Advanced Plasma Science and Its Applications for Nitrides and Nanomaterials)
- Optimized Si-Cap Layer Thickness for Tensile-Strained-Si/ Compressively Strained SiGe Dual-Channel Transistors in 0.13 μm Complementary Metal Oxide Semiconductor Technology
- Investigation of Transport Mechanism for Strained Si n Metal–Oxide–Semiconductor Field-Effect Transistor Grown on Multi-Layer Substrate