SUN Shi | R&D, Wafertech
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概要
関連著者
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SUN Shi
R&D, Wafertech
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Wang Shui
Institute Of Microelectronics Department Of Electrical Engineering National Cheng Kung University
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CHANG Shoou
Institute of Microelectronics, Department of Electrical Engineering, National Cheng Kung University
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CHEN Jone
Institute of Microelectronics and Department of Electrical Engineering, National Cheng Kung Universi
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Wang S
National Cheng Kung Univ. Tainan Twn
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LIU Chun
Department of Environmental Chemistry and Engineering, Interdisciplinary Graduate School of Science
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Chen Jone
Institute Of Microelectronics & Department Of Electrical Engineering National Cheng Kung Univers
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Chang Shoou
Institute Of Microelectronics & Department Of Electrical Engineering National Cheng Kung Univers
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Liaw Uang
Department Of Electronic Engineering Chin-min College
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Liu Chun
Department Of Electronic Engineering Nan-jeon Institute Of Technology Yan-hsui
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Chang Shoou
Institute Of Microelectronics & Department Of Electrical Engineering Center For Micro/nano Scien
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TSAI Hao
Institute of Microelectronics, Department of Electrical Engineering, National Cheng Kung University
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Tsai Hao
Institute Of Microelectronics Department Of Electrical Engineering National Cheng Kung University
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LEE Jiann
Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University
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Lee Jiann
Institute Of Microelectronics & Department Of Electrical Engineering National Cheng Kung Univers
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Sun Shi
R&d Taiwan Semiconductor Manufacturing Company
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Wang Shui
Institute of Microelectronics, Department of Electrical Engineering, National Cheng Kung University, Tainan, Taiwan
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LIU Chun
Department of Electrical Engineering, National Cheng Kung University
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Sun Shi
R&D, Wafertech, Camas, WA 98607, USA
著作論文
- Characterization of Tungsten Carbide as Diffusion Barrier for Cu Metallization
- Effects of Interfacial Oxide Layer for the Ta_2O_5 Capacitor After High-Temperature Annealing
- Characterization of Tungsten Carbide as Diffusion Barrier for Cu Metallization