New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super Chip Integration

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概要

• 論文の詳細を見る
• 2005-09-13

著者

• KOYANAGI Mitsumasa

  Department of Machine Intelligence and Systems Engineering, Tohoku University

• FUKUSHIMA Takafumi

  Department of Bioengineering and Robotics, Tohoku University

• Yamada Yusuke

  Dept. Of Bioengineering And Robotics Graduate School Of Engineering Tohoku University

• Yamada Yusuke

  Department Of Chemical Engineering Faculty Of Engineering Kyushu University

• Koyanagi Mitsumasa

  Cir Tohoku University

• Fukushima Takafumi

  Dept. Of Bioengineering And Robotics Graduate School Of Engineering Tohoku University

• Fukushima Takafumi

  Department Of Advanced Materials Chemistry Graduate School Of Engineering Yokohama National Universi

• KIKUCHI Hirokazu

  Dept. of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University

• KIKUCHI Hirokazu

  Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University

• Koyanagi Mitsumasa

  Dept. Of Bioengineering And Robotics Graduate School Of Engineering Tohoku University

• Koyanagi Mitsumasa

  Department Of Bioengineering And Robotics Graduate School Of Engineering Tohoku University

• Kikuchi Hirokazu

  Dept. Of Bioengineering And Robotics Graduate School Of Engineering Tohoku University

• Fukushima Takafumi

  Department Of Bioengineering And Robotics Graduate School Of Engineering Tohoku University

• Yamada Yusuke

  Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University, 6-6-01 Aza Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan

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