Fukushima Takafumi | Dept. Of Bioengineering And Robotics Graduate School Of Engineering Tohoku University

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概要

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著作論文

New Magnetic Nano-Dot Memory with FePt Nano-Dots
Fabrication and Evaluation of Magnetic Tunnel Junction with MgO Tunneling Barrier
Characteristics of Metal Gate GOI-MOSFET with High-k Gate Dielectric Fabricated by Ge Condensation Method
New Reconfigurable Memory Architecture for Parallel Image Processing LSI with Three-Dimensional Structure
Development of Power Supply System for Three-Dimensionally Staked Retinal Prosthesis Chip
Tungsten Through-Si Via (TSV) Technology for Three-Dimensional LSIs
Memory Window Enhancement of MOS Memory Devices with High Density Self-Assembled Tungsten Nano-dot
Low power spin-transfer magnetoresistive random access memory writing scheme with selective word line bootstrap (Special issue: Solid state devices and materials)
Development of Si Long Microprobe (SiLM) for Platform of Intelligent Neural Implant Microsystem
Evaluation of Electrical Stimulus Current to Retina Cells for Retinal Prosthesis by Using Platinum-Black (Pt-b) Stimulus Electrode Array
Low Power Spin-Transfer MRAM Writing Scheme with Selective Word Line Bootstrap
Sub-Atmospheric Chemical Vapor Deposition Process for Chip-to-Wafer 3-Dimensional Integration
New Three-Dimensional Integration Technology Using Chip-to-Water Bonding to Achieve Ultimate Super-Chip Integration (Special Issue: Solid State Devices & Materials)
Effects of Ion Implantation Damage on Elevated Source/Drain Formation for Ultrathin Body Silicon on Insulator Metal Oxide Semiconductor Field-Effect Transistor (Special Issue: Solid State Devices & Materials)
Low Power and High Sensitivity MRAM Sensing Scheme with Body Biased Preamplifier
Estimation of Wire Length Distribution for Evaluating Performance Improvement of Three-Dimensional LSI
Evaluation of Electrical Stimulus Current to Retina Cells for Retinal Prosthesis
Intelligent Neural Implant Microsystem Fabricated Using Multi-Chip Bonding Technique
Ultimate Functional Multi-Electrode System (UFMES) Based on Multi-Chip Bonding Technique
Three-Dimensionally Stacked Analog Retinal Prosthesis Chip
Deep Trench Etching for Chip-to-Chip Three-Dimensional Integration
New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super Chip Integration
Nickel Germanide Formation on Condensed Ge Layer for Ge-on-Insulator Device Application

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